Sensor Assembly PCB Housing Base Integration

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Solution Overview

Problem

Existing sensor arrangements face limitations in performance due to restricted space within their housings, which restricts the distance between optoelectronic elements and lenses, leading to suboptimal performance and complex adjustment processes.

Innovation Solution

The housing base is formed by a printed circuit board with a metallized plastic housing cover, allowing for increased focal lengths and simplified assembly, improved heat dissipation, and enhanced shielding without additional components, by integrating the printed circuit board as the housing boundary.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If a separate housing base is used in addition to the printed circuit board, then the housing provides sufficient space for components, but the overall height increases and performance is limited

Engineering Contradiction:
Improvehousing spaceVSAvoidoverall height
Core Design Contradiction:
Volume of moving objectVSLength of moving object

Solution Approach 1:

The patent merges the housing base function with the printed circuit board by metallizing the PCB edges and connecting them to the housing cover, eliminating the need for a separate housing base component while maintaining adequate housing space for components

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The printed circuit board is designed to serve multiple functions: it acts as both the electronic circuit carrier and the housing base, providing structural support, electrical connectivity, and electromagnetic shielding while reducing the overall component count and height

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Device complexity

If the printed circuit board forms the housing base, then the number of parts is reduced and assembly is simplified, but additional shielding components are needed

Engineering Contradiction:
Improvenumber of partsVSAvoidelectromagnetic interference
Core Design Contradiction:
Device complexityVSObject-affected harmful factors

Solution Approach 1:

The patent combines the electromagnetic shielding function with the housing cover by applying metallization to the PCB edges and connecting them to the housing cover, which is already made of electrically conductive plastic, thereby providing shielding without requiring separate shielding components

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The housing cover made of electrically conductive plastic serves dual purposes: it provides the structural housing cover function and simultaneously provides electromagnetic shielding when connected to the metallized PCB edges, eliminating the need for separate shielding layers

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances performance, reduces the number of parts, improves electromagnetic compatibility, and simplifies assembly while providing effective shielding and protection against external influences.

Implementation Method 1

the surfaces of the housing cover facing the inside of the housing being coated with a metallization layer

Methodology Applied
Scientific EffectElectromagnetic shielding: Faraday Cage

Implementation Method 2

the printed circuit board itself forms the outer boundary of the housing and the heat-dissipating components are arranged directly on it

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP3355075B1Sensor assembly
Publication Date: 2019.08.28 SICK AG
  • EP3355075B1 patent drawingFigure 1~3
  • EP3355075B1 patent drawingFigure 4~5
  • EP3355075B1 patent drawingFigure 6~7

AI summary

The invention relates to a sensor arrangement comprising at least one electro-optical transmitter (3) and/or at least one electro-optical receiver (4) positioned on a printed circuit board (2), wherein the printed circuit board (2) is arranged in a housing (2, 7) and a housing cover (7) opposite the transmitter and/or receiver (3, 4) has at least one lens (9, 10). In a sensor arrangement in which the performance of the sensor arrangement is improved, a housing base supporting the housing cover (7) is formed by a printed circuit board (2).