3D Temperature Sensor Placement Planning for Data Center Racks
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Solution Overview
Problem
In data centers, the placement of non-contact-type temperature sensors is inefficient due to varying rack distances, leading to calculation errors and increased operational costs during system introduction or layout changes, as existing methods struggle to accurately determine the monitor area coverage and sensor placement.
Innovation Solution
An assistance apparatus that generates monitor area data in a three-dimensional space using dimension, interval, and field-of-view angle data to display recommended temperature sensor positions, allowing for intuitive visualization of monitor areas and optimal sensor placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If non-contact-type temperature sensors are placed on racks in data centers with varying rack distances, then area-wide temperature monitoring is achieved, but calculation errors occur and operational costs increase due to inaccurate monitor area determination
Solution Approach 1:
The patent transitions from two-dimensional planar monitoring to three-dimensional spatial monitoring by considering rack height, depth, and varying distances between racks. The monitor area calculation incorporates Z-axis dimensions (rack height) and accounts for three-dimensional spatial relationships, enabling accurate temperature monitoring despite varying rack distances and orientations.
Solution Approach 2:
The system performs preliminary calculation of monitor areas during the planning stage using the field-of-view angle data and rack dimension data. This allows sensor placement to be optimized before actual deployment, preventing calculation errors and reducing operational costs by avoiding re-placement or surplus/shortage of sensors.
2Device complexity
If sensor placement is planned assuming constant rack distances, then simplified calculations are possible, but calculation errors occur when actual rack distances vary
Solution Approach 1:
The patent employs dynamic calculation methods that adapt to varying rack distances and configurations. Instead of using fixed assumptions, the system calculates monitor areas based on actual rack positions, field-of-view angles, and three-dimensional dimensions, allowing the calculation to adjust automatically to different spatial arrangements.
Solution Approach 2:
The system changes the parameters used in calculations from simplified constant-distance assumptions to actual variable parameters including rack height, depth, distance between racks, and field-of-view angles. This enables accurate monitor area determination that reflects the true spatial configuration of the data center.
3Measurement precision
If actual sensor placement and thermal image checking is performed to determine optimal positions, then accurate monitoring is achieved, but high operational costs are incurred
Solution Approach 1:
The patent performs preliminary determination of sensor placement positions and monitor areas during the planning phase using calculated data from rack dimensions and field-of-view angles. This preliminary action eliminates the need for time-consuming actual placement and thermal image verification, significantly reducing operational time and costs while maintaining accuracy.
Solution Approach 2:
The system creates a virtual model or calculation-based representation of the data center layout and sensor coverage areas. This virtual copy allows for accurate planning and verification without requiring physical sensor placement and actual thermal imaging, thereby reducing operational time and costs.
4Adaptability or versatility
If rack arrangement and sensor arrangement are planned simultaneously with unfinalized distances, then flexibility is maintained, but calculation errors and re-placement are likely
Solution Approach 1:
The patent implements dynamic calculation methods that automatically adjust to changing rack arrangements and distances. As rack positions are finalized or modified, the system recalculates monitor areas and sensor placement requirements, maintaining accuracy throughout the planning process without requiring re-placement or additional sensors.
Solution Approach 2:
The system provides feedback mechanisms that allow planners to verify monitor area coverage and sensor placement accuracy at different stages of the planning process. This feedback enables adjustment of the plan before final implementation, preventing calculation errors and ensuring accurate placement even when rack distances are unfinalized.
Data Source
AI summary
An assistance apparatus according to the disclosure generates monitor area data on the basis of dimension data of rack rows that are each constituted by a plurality of racks and that are arranged in a first direction in a three-dimensional space, the dimension data including the length of each rack row in the first direction and the height thereof in a second direction perpendicular to the first direction, interval data that includes an interval, in a third direction, between the rack rows adjacent to each other in the third direction, the third direction being perpendicular to the first and second directions, field-of-view angle data that includes the field-of-view angle of each temperature sensor, and temperature sensor position data that indicates certain temperature sensor positions; and includes a display control unit that displays monitor coverage information on a display device on the basis of the monitor area data.