Automotive Sensor Assembly via Mechanical Pocket and Overmold

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Solution Overview

Problem

Existing methods for securing sensor components to leadframes or PCBs in automotive vehicles, such as soldering or welding, are inefficient in terms of time and material usage, and may not adequately address environmental stresses like vibration and thermo-mechanical stress.

Innovation Solution

An automotive component assembly method where an input circuit portion is aligned with a component portion, a clamping force is applied to secure the input circuit between two layers forming a pocket, and an overmold material is applied to retain the assembly, providing electrical contact and enhanced resistance to environmental stresses.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If soldering or welding is used to secure the input circuit portion to the leadframe, then reliable electrical contact is achieved, but assembly time increases and material usage increases

Engineering Contradiction:

Improveelectrical contact reliabilityVSAvoidassembly time

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The patent replaces the thermal-based joining methods (soldering and welding) with a mechanical insertion method. The input circuit portion is inserted into a pocket formed by the component portion layers, eliminating the need for heat-based processes and significantly reducing assembly time while maintaining reliable electrical contact through direct physical contact between the input circuit portion and the leadframe.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The pocket structure acts as an intermediary mechanism that facilitates the connection between the input circuit portion and the leadframe. This pocket provides a dedicated receptacle that guides and secures the input circuit portion in the correct position, ensuring reliable electrical contact without requiring complex joining processes.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If soldering or welding is used to secure the input circuit portion to the leadframe, then reliable electrical contact is achieved, but material usage increases

Engineering Contradiction:

Improveelectrical contact reliabilityVSAvoidmaterial usage

Core Design Contradiction:

ReliabilityVSLoss of substance

Solution Approach 1:

The patent eliminates the need for additional soldering materials (solder wire, flux) or welding consumables by using a purely mechanical insertion method. The connection is achieved through the pocket structure and direct contact between components, significantly reducing material usage and waste.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The invention extracts and eliminates the unnecessary materials (solder, flux, welding rods) from the assembly process. By removing these material-intensive joining methods and replacing them with a mechanical pocket-based system, the patent reduces material consumption and associated costs.

Inventive Principle:

Principle #2Taking out (Extraction)

3Ease of manufacture

If traditional welding or soldering processes are used, then the input circuit portion is secured to the leadframe, but resistance to vibrations and environmental stresses is insufficient

Engineering Contradiction:

Improveassembly process simplicityVSAvoidvibration and environmental stress resistance

Core Design Contradiction:

Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The input circuit portion is nested within the pocket formed by the component portion layers (first layer and second layer). This nesting provides mechanical protection and secure retention, enhancing resistance to vibrations and environmental stresses while maintaining assembly simplicity. The pocket structure acts as a protective enclosure that prevents displacement under stress.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The assembly utilizes a composite structure combining the input circuit portion with the component portion layers and overmold material. This multi-material construction provides both ease of manufacture and enhanced resistance to environmental factors, as each material contributes specific properties to the overall assembly's durability.

Inventive Principle:

Principle #40Composite materials

4Productivity

If a pocket structure with clamping force is used to secure the input circuit portion, then assembly time is reduced, but manufacturing precision requirements increase

Engineering Contradiction:

Improveassembly timeVSAvoidalignment precision

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The pocket structure is pre-formed in the component portion during the molding process, before the actual assembly of the input circuit portion. This preliminary action creates a ready-made receptacle with built-in alignment features, reducing the precision requirements during the final assembly step and enabling faster assembly while maintaining adequate manufacturing precision.

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS10539585B2Arrangement and method for connecting an electrical component to a leadframe

Publication Date: 2020.01.21 CONTINENTAL AUTOMOTIVE SYSTEMS INC

AI summary

An automotive component assembly comprises an input circuit portion for a sensor and a component portion. The input circuit portion is aligned with the component portion in a desired assembly position. A pocket is at least partially defined by the component portion to receive the input circuit portion and a clamping force retains the input circuit portion between a first layer and a second layer of the component portion forming the pocket. An overmold material is applied to retain the input circuit portion and the component portion to one another.