Integrated Circuit Sensor With Rear Surface TSV Connections
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Solution Overview
Problem
Conventional integrated circuit sensors face challenges in achieving reliable contact with inspection objects over a large region due to the presence of protective and fixation members on their front surfaces, which can hinder accurate sensing, especially when dealing with flexible or solid objects like human skin or food.
Innovation Solution
The integration of a through silicon via (TSV) connection unit within the integrated circuit sensor allows for electrical connection between the inside and outside of the sensor without using the front surface, enabling a flat and uniform contact area for inspection objects, and the use of spacers or flexible substrates to adjust contact pressure and prevent excessive pressure application.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding and resin protection are used on the front surface of the integrated circuit sensor, then electrical connection and protection are achieved, but the contact area between the inspection object and the sensor front surface is reduced
Solution Approach 1:
The connection unit is moved from the front surface (2D plane) to the rear surface of the sensor, utilizing the third dimension (depth/thickness) of the substrate. This allows electrical connections to be established through the substrate without occupying any space on the front sensing surface, effectively resolving the conflict between connection reliability and contact area.
2Reliability
If fixation and protective members are formed on the front surface of the integrated circuit sensor, then the sensor is protected and fixed, but gaps are formed between the inspection object and the sensor surface
Solution Approach 1:
The protective and fixation functions are extracted from the front surface and relocated to the rear surface of the sensor. The connection unit on the rear surface provides both electrical connection and structural support for fixation, allowing the front surface to remain completely clear and in direct contact with the inspection object, thereby eliminating gaps that would reduce measurement precision.
3Ease of manufacture
If terminal units are exposed on the front surface for wire bonding, then electrical connection is enabled, but the inspection object cannot contact the entire front surface
Solution Approach 1:
Terminal units are positioned on the rear surface of the sensor instead of the front surface, utilizing the vertical dimension of the substrate. This allows wire bonding and other electrical connection methods to be performed on the rear surface without interfering with the front surface sensing area, maximizing the available contact area for inspection objects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures reliable and uniform contact with inspection objects across the entire front surface of the integrated circuit sensor, enhancing sensing accuracy and adaptability to various types of inspection objects by eliminating the need for surface-level connections and adjusting contact pressure effectively.
Implementation Method 1
a connection unit that electrically connects an inside of the integrated circuit sensor and an outside of the integrated circuit sensor is formed in the inside of the integrated circuit sensor so as to reach a rear surface of the integrated circuit sensor
Implementation Method 2
a technique of performing sensing by utilizing a change in an oscillation frequency, which is caused by a magnetic particle included in an inspection object which is in contact with a top of an integrated circuit sensor in which an oscillator is formed in an integrated circuit
Implementation Method 3
detects, by making an inspection object contact with a front surface of the integrated circuit sensor, permittivity or magnetic permeability of the inspection object
Data Source
AI summary
An integrated circuit sensor that enables, regardless of a type of an inspection object, the inspection object and a front surface of the integrated circuit sensor to be in reliable contact with each other in a large region is provided. A through silicon via (11) that electrically connects an inside of an integrated circuit sensor (4) and an outside of the integrated circuit sensor (4) is formed in the inside of the integrated circuit sensor (4) so as to reach a rear surface of the integrated circuit sensor (4), which faces the front surface of the integrated circuit sensor (4).