Semiconductor Sensor Recess Mounting Precision
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor sensor devices face challenges in achieving precise mounting of cylindrical components due to dimension tolerance errors and reduced adhesion strength, which hinders miniaturization and precision, especially with the use of positioning jigs and convex-shaped substrates.
Innovation Solution
A semiconductor sensor device design featuring a substrate with a recessed area for improved positioning and adhesion, where a hollow member with a stepwise face is mounted to increase contact area and precision, and a sealing material fills the hollow member to protect the sensor elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a positioning jig is used to mount the cylinder on the substrate, then the mounting process can be performed, but dimension tolerance errors accumulate and mounting precision deteriorates
Solution Approach 1:
A recess is formed on the substrate as an intermediary structure to receive the cylinder. This recess acts as a mediator between the substrate and cylinder, eliminating the need for external positioning jigs and thereby preventing accumulation of dimension tolerance errors while maintaining manufacturing feasibility
Solution Approach 2:
The invention transitions from two-dimensional surface mounting to three-dimensional recess mounting. By forming a recess that extends into the substrate thickness dimension, the cylinder can be positioned precisely within the recess cavity, eliminating reliance on surface positioning jigs and reducing dimension tolerance accumulation
2Device complexity
If the cylinder bottom face is merely bonded to the substrate by adhesive agent, then the structure is simple, but adhesion strength is reduced and the cylinder may separate
Solution Approach 1:
The bonding interface is extended from a two-dimensional surface bond to a three-dimensional recess bond. The cylinder walls bond to the recess side walls and the cylinder bottom bonds to the recess bottom, creating multiple bonding surfaces that significantly increase total adhesion strength while maintaining structural simplicity
Solution Approach 2:
The recess creates an asymmetric bonding configuration where the cylinder is partially embedded in the substrate. This asymmetric arrangement provides mechanical interlocking in addition to adhesive bonding, with the cylinder walls engaging the recess side walls to prevent separation while keeping the overall structure simple
Data Source
AI summary
Disclosed is a semiconductor sensor device, including a substrate, a sensor element mounted on the substrate, a hollow member configured to surround a periphery of the sensor element, a sealing material configured to fill in the hollow member and cover the sensor element, and a recess formed on the substrate, the recess being configured to position the hollow member.