Sensor System Relief Slits Stress Decoupling
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Solution Overview
Problem
Existing sensor systems suffer from mechanical stress-induced bending of the supporting film, leading to drifting of sensor parameters and offsets in sensor signals, particularly during soldering and thermal expansion differences between materials.
Innovation Solution
Incorporating a relief structure between the contact and sensor elements, which absorbs mechanical stresses and reduces bending, allowing for improved thermal expansion compensation and reduced manufacturing costs by positioning relief slits along a plane parallel to the main plane of extension.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If relief slits are placed outside the cover, then the structure is simple to manufacture, but mechanical stress causes bending of the supporting film in the sensor area
Solution Approach 1:
The supporting element is segmented by introducing relief slits that divide the structure into distinct zones. These slits create a first region between the contact element and sensor element, and a second region on the sensor element side, allowing differential movement and stress distribution that prevents bending in the sensor area while maintaining manufacturing simplicity
Solution Approach 2:
The relief structure acts as an intermediary element between the contact element and the sensor element. It absorbs and redistributes mechanical stresses that arise during soldering and thermal expansion, preventing these stresses from directly affecting the sensor element and causing parameter drift
2Strength
If the supporting film is rigid to maintain structural integrity, then mechanical strength is improved, but thermal expansion differences cause bending in the sensor area
Solution Approach 1:
The supporting element has different mechanical properties in different regions. The relief slits create zones with varying flexibility - the first region can deform to accommodate thermal expansion differences, while the second region maintains sufficient rigidity to support the sensor element, thus locally optimizing both strength and thermal compensation
Solution Approach 2:
The relief structure modifies the mechanical parameters of the supporting element by introducing controlled flexibility through the slits. This allows the supporting element to change its stiffness characteristics in response to thermal stresses, preventing bending in the sensor area while maintaining overall structural integrity
3Device complexity
If no relief structure is used to maintain a simple design, then device complexity is reduced, but mechanical stresses during soldering cause bending and parameter drifting
Solution Approach 1:
The relief slits segment the supporting element into functional zones that can move independently, absorbing soldering stresses without requiring complex external relief structures. This segmentation approach maintains design simplicity while significantly improving reliability by preventing stress transmission to the sensor element
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly reduces or prevents sensor parameter drifting and signal offsets, achieving high measuring precision without the need for additional adjustments, while effectively managing thermal stress through the use of a damping element and strategically placed relief slits.
Implementation Method 1
the at least one relief structure is formed essentially between the at least one contact element and the sensor element, so that mechanical stresses which arise between the contact element and the supporting element do not result in bending of the supporting element in the area of the sensor element, but rather are absorbed by the relief structure
Implementation Method 2
mechanical stresses which are based on differing thermal coefficients of expansion of the supporting element and the contact element are also compensated for
Implementation Method 3
the use of a damping element and strategically placed relief slits
Data Source
AI summary
A sensor system includes a supporting element and a sensor element attached to the supporting element and having a main plane of extension. The supporting element has (i) at least one contact element for electrical contacting of the sensor system and (ii) at least one relief structure for stress decoupling, the at least one relief structure being situated in a plane parallel to the main plane of extension essentially between the at least one contact element and the sensor element.