Power Semiconductor Module Current Sensor Rotation Bar Alignment
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Solution Overview
Problem
The existing power semiconductor modules require different current sensor modules for varying busbar thicknesses, leading to inaccurate sensing and increased tooling costs due to the need for multiple module designs.
Innovation Solution
A power semiconductor module design featuring an electrically insulative frame with a receptacle and a rotation bar that allows a single type of current sensor module to be used across different busbar thicknesses, enabling free rotation for accurate alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If different current sensor modules are used for different busbar thicknesses, then current sensing accuracy is improved, but device complexity and tooling costs increase
Solution Approach 1:
The current sensor module is designed with a universal receptacle structure that can accommodate busbars of different thicknesses. The receptacle includes adjustable positioning elements and a rotation bar mechanism that allows the same sensor module to be properly aligned with various busbar dimensions, eliminating the need for multiple specialized sensor module designs.
Solution Approach 2:
The current sensor module incorporates a rotation bar that can rotate about an axis to dynamically adjust the alignment between the sensor and the busbar. This dynamic adjustment capability allows the sensor module to adapt to different busbar thicknesses and positions, maintaining accurate current sensing across varying configurations without requiring multiple fixed-design sensor modules.
2Measurement precision
If different current sensor modules are used for different busbar thicknesses, then current sensing accuracy is improved, but manufacturing costs increase
Solution Approach 1:
The current sensor module is designed with a universal receptacle structure that can accommodate busbars of different thicknesses. The receptacle includes adjustable positioning elements and a rotation bar mechanism that allows the same sensor module to be properly aligned with various busbar dimensions, eliminating the need for multiple specialized sensor module designs.
3Manufacturing precision
If the current sensor module is fixed in position, then manufacturing precision is improved, but adaptability to different busbar thicknesses deteriorates
Solution Approach 1:
The current sensor module incorporates a rotation bar that can rotate about an axis to dynamically adjust the alignment between the sensor and the busbar. This dynamic adjustment capability allows the sensor module to adapt to different busbar thicknesses and positions, maintaining accurate current sensing across varying configurations without requiring multiple fixed-design sensor modules.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design ensures accurate current sensing regardless of busbar thickness, reducing the need for multiple module types and associated costs while maintaining alignment tolerances.
Implementation Method 1
a first rotation bar jutting out from a first sidewall of the receptacle and onto the exposed part of the busbar without obstructing the opening in the busbar, wherein the first rotation bar forms an axis of rotation within the receptacle
Implementation Method 2
a core-less in-phase current sensor is a magnetic sensor that implements one or more sensing elements in close proximity to a current rail such that a measurement can be obtained based on a magnetic field produced by a current flowing through the current rail
Data Source
AI summary
A power semiconductor module includes: an electrically insulative frame having opposite mounting sides and a border wall that defines a periphery of the frame; a substrate seated in the frame; power semiconductor dies attached to the substrate; signal pins attached to the substrate and electrically connected to the power semiconductor dies; a busbar attached to the substrate and extending through the border wall; a receptacle in the border wall configured to receive a current sensor module and that exposes part of the busbar, the exposed part of the busbar having an opening; and a rotation bar jutting out from a sidewall of the receptacle and onto the exposed part of the busbar without obstructing the opening in the busbar, wherein the rotation bar forms an axis of rotation within the receptacle. A power electronic assembly that incorporates the power semiconductor module and corresponding method of production are also described.


