Imaging Sensor Sealing Structure for Precise Lens Alignment

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Solution Overview

Problem

Existing imaging apparatuses suffer from degraded alignment accuracy due to the multiplication of alignment errors in the installation of the imaging element and the substrate, leading to inaccuracies in positioning with the lens barrel.

Innovation Solution

The imaging apparatus incorporates a sealing section with fitting sections, such as recesses or projections, that facilitate precise alignment of the lens unit with the imaging element by allowing for improved positioning through the use of fitting sections like through holes, notches, or projections, which are integrated with the sealing section to enhance alignment accuracy.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the substrate is attached to the support with multiple alignment steps, then the imaging element can be properly positioned, but the alignment accuracy degrades due to multiplication of alignment errors

Engineering Contradiction:
Improvealignment accuracyVSAvoidalignment process complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent combines the substrate attachment and lens barrel positioning functions into a single integrated support structure. The support includes positioning protrusions that simultaneously align the substrate and the lens barrel, eliminating multiple separate alignment steps and their associated error accumulations.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent introduces positioning protrusions as intermediary elements between the support, substrate, and lens barrel. These protrusions serve as reference features that enable precise alignment without requiring complex multi-step adjustment procedures, thereby reducing alignment errors.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Measurement precision

If the support is installed to the lens barrel with positioning pins and screws, then the imaging element can be aligned through the substrate and support, but the multiplication of alignment inaccuracies occurs

Engineering Contradiction:
Improvepositioning accuracyVSAvoidassembly complexity
Core Design Contradiction:
Measurement precisionVSEase of manufacture

Solution Approach 1:

The patent merges the positioning pin and screw fastening functions into an integrated positioning protrusion structure. The positioning protrusions are formed as integral parts of the support, combining alignment and fixation functions into a single feature that reduces assembly complexity while maintaining positioning accuracy.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent extracts the positioning function from the complex multi-component assembly (positioning pins and screws) and implements it through simplified positioning protrusions formed directly on the support structure. This extraction eliminates unnecessary components and reduces the number of alignment operations required.

Inventive Principle:
Principle #2Taking out (Extraction)

Data Source

PatentUS12356737B2Imaging apparatus and manufacturing method of the same
Publication Date: 2025.07.08 SONY SEMICON SOLUTIONS CORP
  • US12356737B2 patent drawing
  • US12356737B2 patent drawing
  • US12356737B2 patent drawing

AI summary

An imaging apparatus includes an imaging element, a wiring substrate, a sealing section, and fitting sections. The imaging element includes an imaging chip and pads. A light transmission section that transmits incident light is arranged on the imaging chip, and the imaging chip generates an image signal based on the incident light that has transmitted through the light transmission section. The pads are arranged on a bottom surface of the imaging chip which is a surface different from the surface on which the light transmission section is arranged and convey the generated image signal. The wiring substrate includes wiring that is connected to the pads, and the imaging element is arranged on a front surface of the wiring substrate. The sealing section is arranged adjacent to side surfaces of the imaging chip which are the surfaces adjacent to the bottom surface of the imaging chip and seals the imaging chip.