Sensor Assembly Sealing Ring for Analyte Detection
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Solution Overview
Problem
Current continuous monitoring systems for analyte concentrations in body fluids, such as glucose, face challenges with complex and voluminous encapsulation techniques, leading to high manufacturing costs and difficulties in miniaturization, as well as precision issues with sealing elements like O-rings.
Innovation Solution
A sensor assembly with a sealing ring applied directly to the contact portion of the sensor, using a silicone copolymer material like Geniomer, which surrounds the electrical contacts, allowing for a flat seal with low construction height and reduced component count, simplifying manufacturing and integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If complex encapsulation techniques are used to seal electrical contacts, then reliability of protection against environmental influences is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent combines the sealing function and electrical contact function into a single integrated contact pad structure. The contact pad serves both as an electrical conductor and as a sealed interface with the environment, eliminating the need for separate encapsulation components. This merging of functions directly reduces device complexity while maintaining protection reliability.
Solution Approach 2:
The contact pad is designed to perform multiple functions simultaneously: it provides electrical contact, seals against environmental influences like humidity, and serves as a structural element. This multi-functionality eliminates the need for additional dedicated sealing components, thereby reducing overall device complexity while ensuring reliable protection.
2Reliability
If traditional sealing elements like O-rings are used, then protection against environmental influences is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent extracts the sealing function from separate mechanical sealing elements like O-rings and integrates it directly into the contact pad structure itself. By taking out the dedicated sealing component and embedding the sealing capability within the contact pad, the design eliminates precision alignment requirements between separate parts while maintaining effective sealing performance.
Solution Approach 2:
The sealing function is merged with the electrical contact function in a single integrated structure. The contact pad's geometry and material properties provide both electrical conductivity and sealing capability, eliminating the need for precise assembly of separate sealing elements and thereby reducing manufacturing precision requirements.
3Reliability
If complex encapsulation techniques are used, then protection against environmental influences is improved, but manufacturing cost increases
Solution Approach 1:
The contact pad integrates multiple functions (electrical contact, sealing, and structural support) into a single component that can be manufactured in one step using standard PCB or thin-film fabrication techniques. This eliminates the need for multiple assembly steps and separate sealing components, thereby reducing manufacturing cost while maintaining reliable protection against humidity.
Solution Approach 2:
The contact pad serves multiple purposes simultaneously, eliminating the need for separate dedicated sealing components. This multi-functionality reduces the total component count and assembly complexity, leading to lower manufacturing costs while ensuring adequate protection against environmental influences.
4Reliability
If separate sealing components are used, then protection against environmental influences is improved, but device volume increases
Solution Approach 1:
The sealing function is merged into the contact pad structure itself, eliminating the need for separate sealing components that would add volume. The contact pad's integrated design provides sealing performance without requiring additional space for separate O-rings or encapsulation layers, thereby reducing overall device volume.
Data Source
AI summary
A sensor (110), a sensor assembly (256) for detecting at least one analyte in a body fluid and methods of manufacturing a sensor (110) and a sensor assembly (256) for detecting at least one analyte in a body fluid are disclosed. The sensor (110) has at least one substrate (114). The sensor (110) further has at least two electrodes (116) applied to the substrate (114), wherein the electrodes (116) are adapted for detecting the analyte. The sensor (110) further has at least two contact pads (118) applied to the substrate (114) and at least two electrical traces (120) applied to the substrate (114). The electrical traces (120) electrically connect the electrodes (116) and the contact pads (118). The sensor (110) further comprises a sealing ring (134) fixedly applied to the substrate (114). The sealing ring (134) surrounds the contact pads (118).