Sensor Device Segmentation on Melt-Moldable Substrate
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Solution Overview
Problem
Current chemical and biosensors face limitations in efficiently detecting and analyzing chemical or biological species, particularly in terms of reagent volume minimization and high-throughput screening, as well as in the design of microfluidic systems for quantitative analysis.
Innovation Solution
The development of an electronic sensor device integrated with a semiconductor chip on a silicon substrate, utilizing thin-film technologies and printing methods for conductive connections and coatings, embedded in a melt-formable substrate, which is then integrated into a microfluidic device with a multilayer polymer structure for enhanced detection capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If semiconductor chips and sensor devices are integrated on a silicon substrate, then electrical connection and signal amplification are achieved, but production cost increases and semiconductor surface is wasted
Solution Approach 1:
The invention separates the sensor device from the semiconductor chip by placing the sensor on an independent substrate (petri dish bottom) and the semiconductor chip on a separate carrier (printed circuit board). This segmentation allows each component to be optimized and manufactured independently, reducing waste of semiconductor surface while maintaining electrical connection through conductive adhesive layers.
Solution Approach 2:
The invention introduces conductive adhesive layers as intermediaries to establish electrical connection between the sensor device and the semiconductor chip. These adhesive layers serve as mediators that transfer electrical signals without requiring direct integration on the silicon substrate, thereby reducing production cost while maintaining sensitivity.
2Measurement precision
If complex electrical connections are made between sensor and amplifier, then signal transmission is achieved, but signal degradation increases
Solution Approach 1:
The invention extracts the amplifier function from the integrated circuit and places it on a separate semiconductor chip mounted on the printed circuit board. This extraction simplifies the electrical connection path between the sensor and the amplification function, reducing signal degradation while maintaining signal quality.
Solution Approach 2:
The invention replaces complex wire bonding or trace routing with direct conductive adhesive connections. This substitution simplifies the electrical connection system and reduces the number of interfaces where signal degradation could occur, thereby improving signal quality with reduced complexity.
3Adaptability or versatility
If sensor devices are integrated into microfluidic systems, then detection functionality is achieved, but integration complexity increases
Solution Approach 1:
The invention segments the microfluidic system into modular components: the petri dish bottom serves as the sensor substrate, the printed circuit board carries the semiconductor chip, and these are connected through standardized interfaces. This segmentation enables easier integration into microfluidic systems by providing clear separation of functions and simplified assembly procedures.
Solution Approach 2:
The invention creates a universal platform where the sensor device on the petri dish bottom can be integrated with various microfluidic configurations. The standardized conductive adhesive connection and separate carrier design allow the sensor to function in multiple microfluidic setups, increasing adaptability while reducing integration complexity.
4Measurement precision
If long connection lines are used between electrode and amplifier, then electrical connection is achieved, but sensitivity decreases
Solution Approach 1:
The invention merges the sensor device and amplifier on the same printed circuit board carrier, eliminating the need for long external connection lines. The conductive adhesive layers provide short, direct electrical paths between the electrode and the amplifier circuit, maintaining high sensitivity by minimizing connection length.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient detection of chemical and biological species with reduced reagent volume, rapid analysis, and high-throughput screening, while allowing for selective detection of various species through functionalized sensor devices within a compact and efficient microfluidic system.
Implementation Method 1
a field effect transistor is implemented on a silicon substrate, the gate of which forms a detection electrode of the sensor
Implementation Method 2
an electrode made of gold is deposited on a silicon substrate
Data Source
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AI summary
The electronic sensor device (10) has a semiconductor-chip (30) manufactured from a semiconductor substrate, where the semiconductor-chip is formed for one or multiple functions. A sensor unit (40,40') is provided with an active sensor upper surface (42) and is formed to detect the chemical or biological species and to generate an electrical signal. A substrate (20) is provided with a substrate upper surface (22) and is made from a melt-moldable material. Independent claims are included for the following: (1) a micro-fluidic device with a polymer substrate; (2) a method for manufacturing an electronic sensor device; and (3) a method for manufacturing a micro-fluidic device.