Sensor Device With Segmented Support Elements For Thermal Isolation

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Solution Overview

Problem

Existing sensor devices for climate parameter sensing face challenges in thermal management and isolation, limiting their application range and accuracy, especially when exposed to external heat sources and air flow.

Innovation Solution

A sensor device with a system carrier featuring two planar support elements and an integrated signal-processing component, where at least two temperature sensors are positioned near each support element, and a low thermal resistance securing material is used between the component and the support elements, along with a thermally insulating encapsulation, allowing for improved thermal isolation and heat transfer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a single support element is used for the signal-processing component, then the device structure is simple, but the temperature measurement accuracy and thermal isolation are insufficient

Engineering Contradiction:

Improvetemperature measurement accuracyVSAvoidsupport element structure

Core Design Contradiction:

Measurement precisionVSDevice complexity

Solution Approach 1:

The single support element is divided into two separate planar support elements. The first support element supports a first region of the signal-processing component while the second support element supports a second region, enabling independent thermal zones for accurate temperature measurement and thermal isolation

Inventive Principle:

Principle #1Segmentation

2Temperature

If the signal-processing component is closely coupled to the support element, then the mechanical stability is high, but the thermal isolation between different regions is poor

Engineering Contradiction:

Improvethermal isolationVSAvoidmechanical stability

Core Design Contradiction:

TemperatureVSStability of the object's composition

Solution Approach 1:

The support structure is segmented into two separate support elements that are electrically and thermally isolated from each other. Each support element provides mechanical support to its designated region while maintaining thermal isolation, allowing independent temperature control and measurement zones

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

An encapsulation material is introduced as an intermediary between the support elements and the signal-processing component. This encapsulation provides mechanical coupling while offering thermal resistance to improve thermal isolation between different regions of the device

Inventive Principle:

Principle #24Intermediary (Mediator)

3Reliability

If traditional encapsulation is used, then the device is protected from damage, but the thermal management capability is limited

Engineering Contradiction:

Improvedevice protectionVSAvoidthermal management

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The encapsulation is configured to provide different thermal properties in different regions. The encapsulation material is positioned to provide thermal isolation between support elements while allowing controlled thermal pathways, enabling localized thermal management and protection

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances the sensor's ability to perform multiple temperature measurements, compensate for external heat influences, and infer air flow velocity, expanding its application scope by improving thermal management and accuracy.

Implementation Method 1

At least two temperature sensors are integrated within the signal-processing component, with each of the temperature sensors being disposed in a vicinity of a respective one of the support elements

Methodology Applied

Scientific EffectTemperature sensing: Thermistor

Implementation Method 2

a low thermal resistance securing material is used between the component and the support elements, along with a thermally insulating encapsulation

Methodology Applied

Scientific EffectThermal insulation: Thermal Insulation

Implementation Method 3

a low thermal resistance securing material is used between the component and the support elements

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10352773B2Sensor device having integrated temperature sensors

Publication Date: 2019.07.16 E E ELEKTRONIK GES

AI summary

A sensor device includes a system carrier including at least a first planar support element and a second planar support element. The support elements are disposed in a mounting plane at a distance from one another. An integrated signal-processing component is disposed on the support elements. An encapsulation at least partially encloses the signal-processing component. At least two temperature sensors are integrated within the signal-processing component. Each of the temperature sensors is disposed in a vicinity of a respective one of the support elements.