Sensor System With Segmented Wafer Elements
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Solution Overview
Problem
Existing sensor systems face challenges in achieving high performance with reduced noise and offset errors while maintaining low development costs and small installation size, especially in size-sensitive applications, due to high development expenditures and complex system integration.
Innovation Solution
A sensor system utilizing individual and separate semiconductor components, mechanically connected and electrically connected via a redistribution level, allowing for flexible array configurations and scalable performance with low development costs, implemented as a chip-scale package with vertically integrated wafer stacks and through-silicon vias for signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If multiple sensor elements are evaluated to achieve lower-noise signal, then signal quality is improved, but system integration expenditure and installation size increase
Solution Approach 1:
The sensor system is divided into multiple individual sensor elements (first sensor element, second sensor element, etc.) that are separately functional but collectively evaluated. Each element can be independently manufactured and tested, then combined in arrays of different configurations (2×1, n×m) to achieve noise reduction through signal averaging while maintaining modular integration that reduces overall system complexity expenditure
Solution Approach 2:
The sensor elements are designed with universal functionality where identical sensor elements can serve multiple purposes: individual operation for basic sensing, combined operation in arrays for enhanced precision, and flexible configuration for different application requirements. This multi-functionality allows the same basic sensor design to achieve both low-noise performance through array evaluation and reduced integration complexity through standardized components
2Measurement precision
If vertical integration of MEMS wafer and ASIC wafer is implemented, then sensor performance is improved, but development costs increase significantly
Solution Approach 1:
The vertically integrated sensor system is segmented into separate manufacturable units: individual sensor elements with their own evaluation circuits, that can be produced using standard MEMS and ASIC processes. This segmentation allows each component to be manufactured independently using existing mass production techniques, avoiding the need for expensive custom integrated development while still enabling high-performance vertical integration when needed
Solution Approach 2:
The system allows parameter changes in configuration without requiring new development: sensor elements can be arranged in different array configurations (2×1, n×m arrangements), and the same basic sensor design can be scaled to achieve different performance levels. This parameter flexibility enables niche applications with increased performance demands to be operated cost-effectively without separate product development
3Measurement precision
If array configurations of sensor elements are created, then noise reduction is achieved, but installation size increases
Solution Approach 1:
Multiple sensor elements are arranged in compact array configurations where elements are nested or closely packed together in space-efficient patterns (2×1, n×m arrays). This nesting approach allows noise reduction through multiple elements while minimizing the overall installation footprint by optimizing the spatial arrangement of sensor elements within a compact package
Data Source
AI summary
A sensor system including a plurality of individual and separate sensor elements. Each of the individual sensor elements is independently functional. The individual sensor elements of the sensor system being formed in one piece from parts of a wafer or a vertically integrated wafer stack. The sensor system including at least one separation structure, in particular a scribe line, between the individual and separate sensor elements.