Sensor Sheet Segmentation and Wiring Substrate Coupling
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Solution Overview
Problem
Existing methods for manufacturing large-area sensor sheets by electrically coupling small-area sensor sheets face challenges in reliability due to stress concentration at coupling points, leading to reduced yield and increased component count.
Innovation Solution
A sensor sheet design featuring unit sensor sheets with electrode layers and a wiring substrate, where conductive bonding members ensure electrical coupling without the need for additional coupling members, reducing stress concentration and enhancing reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If small-area sensor sheets are electrically coupled to obtain large-area sensor sheets, then large-area high-definition sensor sheets can be manufactured, but stress concentration occurs at coupling points leading to reduced reliability
Solution Approach 1:
The sensor sheet is divided into multiple unit sensor sheets that are coupled together to form a large-area sensor sheet. Each unit sensor sheet includes a sensor layer and electrode layer on a substrate, and these units are electrically coupled through conductive bonding members to achieve both large area and maintained reliability
Solution Approach 2:
Multiple unit sensor sheets are merged with a wiring substrate through conductive bonding members. The wiring substrate integrates the electrical coupling function, allowing multiple sensor units to be connected without requiring separate coupling members between each adjacent pair, thereby reducing stress concentration points
2Reliability
If multiple coupling members are used to electrically couple unit sensor sheets, then electrical connectivity is achieved, but component count increases and manufacturing complexity increases
Solution Approach 1:
The wiring substrate serves multiple functions: it provides electrical coupling for multiple unit sensor sheets, acts as a structural support, and integrates the connection architecture. This multi-functional design eliminates the need for separate coupling members between each sensor unit pair
Solution Approach 2:
The wiring substrate acts as an intermediary component that receives electrical signals from multiple unit sensor sheets through conductive bonding members and routes them appropriately. This central intermediary approach simplifies the overall coupling structure compared to direct peer-to-peer coupling between sensor units
3Area of stationary object
If conventional coupling methods are used to assemble unit sensor sheets, then large-area sensor sheets can be formed, but yield is reduced due to stress concentration
Solution Approach 1:
The sensor sheet is segmented into multiple unit sensor sheets that can be manufactured separately and then coupled. This segmentation allows for standardized production of smaller units with higher yield, which are then assembled into large-area configurations
Solution Approach 2:
Multiple unit sensor sheets are merged onto a single wiring substrate using conductive bonding members. This merging approach distributes stress across the entire assembly rather than concentrating it at multiple discrete coupling points, thereby improving overall manufacturing yield
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for high-yield production of reliable large-area sensor sheets with reduced component count and simplified manufacturing, maintaining detection accuracy across multiple points without stress concentration.
Implementation Method 1
a conductive bonding member configured to electrically couple each of the plurality of unit sensor sheets and the wiring substrate with each other
Data Source
AI summary
A sensor sheet includes unit sensor sheets configured to detect a physical property value at multiple points on a sensor layer, each unit sensor sheet including a first substrate, and an electrode layer and the sensor layer sequentially formed on one side of the first substrate; and a wiring substrate to which the unit sensor sheets are configured to be coupled, the wiring substrate including a second substrate, and a plurality of wirings provided on one side of the second substrate. One side of the wiring substrate and one side of each unit sensor sheet are facing each other. A conductive bonding member configured to electrically couple each unit sensor sheet and the wiring substrate with each other, is included between the electrode layer of each unit sensor sheet and at least one of the wirings of the wiring substrate.