Measurement Sensor Package Shielding for Blood Flow Accuracy
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Solution Overview
Problem
Existing measurement sensors for blood flow measurement using the Doppler effect face challenges in accuracy and reliability due to electromagnetic noise and optical noise, which affect the precision of blood flow measurements.
Innovation Solution
The measurement sensor package incorporates a substrate with recesses for a light emitter and receiver, a metallic thin layer for electromagnetic shielding, and internal ground conductor layers to reduce electromagnetic noise, and a lid for light transmission and charge discharge, enhancing measurement accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If electromagnetic shielding structures are added to reduce noise, then measurement accuracy is improved, but device complexity increases
Solution Approach 1:
The patent combines multiple shielding functions into a single integrated substrate structure. The substrate simultaneously provides mechanical support, electrical grounding, and electromagnetic shielding through its conductive layer configuration, eliminating the need for separate shielding components and reducing overall device complexity while maintaining measurement accuracy.
Solution Approach 2:
The substrate is designed to perform multiple functions: it serves as the structural base for mounting the light emitter and receiver, provides electrical connection pathways, establishes ground references for signal processing, and creates electromagnetic shielding zones. This multi-functionality reduces the total component count and simplifies the overall sensor package design.
2Measurement precision
If internal ground conductor layers are incorporated to reduce electromagnetic noise, then signal quality is improved, but manufacturing complexity increases
Solution Approach 1:
The patent optimizes the conductive layer configuration by adjusting parameters such as layer thickness, pattern geometry, and material composition to achieve effective electromagnetic noise reduction. These parameter optimizations ensure that the shielding structures can be manufactured using standard PCB fabrication processes without requiring specialized or complex manufacturing steps.
3Reliability
If a lid with light transmission properties is added for charge discharge, then measurement reliability is improved, but device complexity increases
Solution Approach 1:
The lid is designed to simultaneously serve as a protective enclosure, a light transmission window for optical signal passage, and an electrical interface for charge discharge. By integrating these multiple functions into a single component, the patent avoids adding separate elements and maintains device simplicity while improving measurement reliability through stable electrical contact and protected optical pathways.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces electromagnetic and optical noise, improving the accuracy and reliability of blood flow measurements by shielding the light receiver from noise and ensuring reliable light transmission.
Implementation Method 1
a metallic thin layer for electromagnetic shielding, and internal ground conductor layers to reduce electromagnetic noise
Implementation Method 2
a lid for light transmission... The sensor includes a substrate, an illuminator arranged on the substrate to illuminate blood with light
Implementation Method 3
Measurement of blood flow uses, for example, the Doppler effect of light... The frequency of the illuminating light and the frequency of the scattered light are used to calculate the traveling speed of the blood cells
Data Source
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AI summary
A measurement sensor package and a measurement sensor improve reliability in strength and other aspects. A measurement sensor package (11) includes a substrate (2), a lid (3), a ground conductor layer (4), a metallic thin layer (5), and a bond (6). The ground conductor layer (4) and the metallic thin layer (5) are arranged inside the bond (6) that extends continuously as viewed through from above. The bond (6) directly bonds a first main surface (21) of a substrate body (20) and a facing surface (3a) of the lid (3) together along the entire periphery. This improves the reliability in strength.