Temperature Sensor Snap-In Circuit Board Assembly
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Solution Overview
Problem
The production and assembly of temperature sensors for thermal flow-measuring devices face high rejection rates due to complex connection concepts and mounting challenges, particularly with RTD elements in sensor housings.
Innovation Solution
A temperature sensor design featuring a housing with protruding shells containing thin-film resistance thermometers, where connection wires are secured to a circuit board via a snap-in connection and strain relief mechanism, and elastic bodies are used to guide and secure the wires, reducing susceptibility to vibrations and improving assembly efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional connection concepts with mounting in shells are used, then the temperature sensor can be manufactured, but the production rejection rate is high and assembly is difficult
Solution Approach 1:
The housing is divided into a housing body and separate shells that protrude from it. Each shell can be independently manufactured and then assembled to the housing body, allowing for modular production that reduces assembly complexity and improves manufacturing ease while maintaining product reliability.
Solution Approach 2:
Connection wires serve as intermediaries between the temperature sensor elements mounted in the shells and the circuit board in the housing body. This intermediary connection system allows for flexible wiring and simplifies the assembly process by enabling separate mounting of sensor elements and electrical connections.
2Reliability
If complex connection concepts are used for RTD elements, then the temperature sensor can be assembled, but the assembly process becomes difficult and rejection rate increases
Solution Approach 1:
The connection system is segmented into discrete components: temperature sensor elements in shells, connection wires, and a circuit board in the housing body. This segmentation allows each component to be manufactured and tested separately, reducing assembly complexity and improving the overall assembly success rate.
Solution Approach 2:
The patent transitions from conventional RTD elements to thin-film resistance thermometers, changing the physical form and electrical characteristics of the temperature sensing element. This parameter change enables simpler integration with the circuit board and reduces the complexity of the connection concept while maintaining measurement reliability.
3Ease of manufacture
If thin-film resistance thermometers are used instead of conventional RTD elements, then the cross section changes from round to rectangular, but the heat transfer characteristics are affected
Solution Approach 1:
The patent deliberately changes the geometric parameters of the temperature sensor element from cylindrical RTD wires to rectangular thin-film structures. This parameter change enables more precise control of the sensing element dimensions and improved manufacturing consistency, while the rectangular cross-section allows for optimized thermal contact surfaces.
Solution Approach 2:
The thin-film resistance thermometer consists of a platinum layer deposited on a substrate, forming a composite structure. This composite material approach allows for precise control of thermal and electrical properties, ensuring consistent heat transfer characteristics while facilitating easier manufacturing compared to conventional RTD elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design simplifies the assembly process, reduces rejection rates, and enhances the stability and sealing of the temperature sensor, while maintaining effective thermal measurement capabilities.
Implementation Method 1
a temperature sensor element is arranged, which has especially a thin-film resistance thermometer
Implementation Method 2
One of the two temperature sensors is a so-called active temperature sensor, which is heated by means of a heating unit and which determines a temperature. Provided as a heating unit is either an additional resistance heater, or the temperature sensor itself is a resistance element
Implementation Method 3
Positioning the circuit board in the housing chamber by means of a snap-in connection facilitates assembly. The snap-in connection can be produced advantageously by shape interlocking between the circuit board and the housing body
Implementation Method 4
the connection wire is connected with strain relief with the circuit board
Data Source
AI summary
A temperature sensor and a flow measuring device. The temperature sensor comprising: a housing which comprises a housing body from which at least a first shell and a second shell protrude, each of which shells comprises a first end section, a second end section and a longitudinal axis. A temperature sensor element is arranged, which has especially a thin-film resistance thermometer, wherein one of the temperature sensor elements is heatable, and which shells have outsides, which interface the housing with the environment. From each temperature sensor element at least one connection wire leads away, which is connected with a circuit board. The housing body has a housing chamber, which is connected with inner hollow spaces of the shells, wherein the circuit board is arranged in the housing chamber, and wherein the circuit board is positioned in the housing chamber by a snap-in connection.