Sensor Attachment Using Spacer to Control Adhesive Thickness
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Solution Overview
Problem
Attaching a sensor device to a thin portion of a member is challenging due to the difficulty in forming a protruding portion on flexible boards, which affects the dimensional accuracy and adhesive thickness, making existing attachment structures unsuitable.
Innovation Solution
A sensor-device attachment structure that uses a spacer formed into a film with uniform thickness, sandwiched between the flexible board and the thin portion, with through portions for the adhesive to bond them securely, allowing adjustable adhesive thickness and easy management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a protruding portion is formed on a flexible board to secure adhesive thickness, then the adhesive thickness can be maintained, but it is difficult to form the protruding portion due to the thinness of the flexible board
Solution Approach 1:
A spacer is introduced as an intermediary component between the flexible board and the member. The spacer has a through portion that receives adhesive, and its thickness determines the adhesive thickness. This mediator solves the problem by providing a structure that maintains adhesive thickness without requiring modification of the thin flexible board itself.
Solution Approach 2:
The attachment structure is segmented into distinct functional components: the flexible board, the spacer, and the member. The spacer is further segmented with a through portion that separates the adhesive charging function from the bonding function, allowing independent optimization of each component.
2Manufacturing precision
If a protruding portion is formed on a thin portion of a member, then the adhesive thickness can be secured, but it is difficult to form the protruding portion and secure dimensional accuracy
Solution Approach 1:
The spacer serves as an intermediary that transfers the adhesive from the member to the flexible board. The through portion of the spacer is positioned to receive adhesive, and the spacer's uniform thickness ensures consistent adhesive thickness without requiring complex protruding structures on the member.
3Reliability
If adhesive is charged without gaps between the glass base and recessed part, then complete bonding is achieved, but this structure cannot be employed when using flexible boards due to inability to form protruding portions
Solution Approach 1:
The spacer enables complete adhesive bonding on flexible boards by providing a through portion that ensures adhesive is present throughout the bonding interface. The spacer acts as a template that guides adhesive placement, ensuring no gaps remain between the flexible board and member.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Secures the adhesive thickness and ensures proper bonding between the flexible board and the thin portion, enhancing the stability and consistency of the attachment, even for multiple sensor devices, and facilitating mass production.
Implementation Method 1
an adhesive that is charged in the through portion and bonds the thin portion and the flexible board to each other
Data Source
AI summary
Provided is a sensor-device attachment structure including: a thin portion that is thinner than other parts of a member; a flexible board; an at least one sensor device installed to the flexible board; a spacer that is formed into a shape of a film having a uniform thickness, that is sandwiched between the thin portion and the flexible board, and that includes a through portion which is formed through the spacer in a thickness direction of the spacer at a position corresponding to the at least one sensor device; and an adhesive that is charged in the through portion, and that bonds the thin portion and the flexible board to each other.