Temperature Sensor Spring Clip for Thermal Cycling and Vibration
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Solution Overview
Problem
High temperature sensors, particularly exhaust gas temperature sensors, face issues with excessive compressive and tensile stresses due to high heating and cooling gradients, leading to damage of internal components and conductors, and are not adequately addressed by existing expansion-contraction compensating mechanisms that fail to account for vibration.
Innovation Solution
Incorporation of a spring clip within the sensor design to absorb expansion and contraction deformations, with asymmetric shapes and stopping features to prevent material movement, allowing for dedicated material selection and improved vibration resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If rigid connections are used between sensing element and conductors, then structural stability is improved, but stress damage from thermal expansion/contraction increases
Solution Approach 1:
The patent employs flexible printed circuit boards (FPC) instead of rigid printed circuit boards (PCB) to connect the sensing element to external conductors. The FPC can bend and deform elastically to accommodate thermal expansion and contraction of the sensing element during thermal-cycling, preventing stress concentration and connection failure while maintaining electrical connectivity and structural integrity.
2Reliability
If expansion-contraction compensating mechanisms are added, then survival under thermal-cycling is improved, but vibration resistance is not adequately addressed
Solution Approach 1:
The flexible printed circuit board serves multiple functions simultaneously: it provides electrical connectivity between the sensing element and external circuitry, accommodates thermal expansion/contraction through its flexibility, and dampens vibration effects. This multi-functional design addresses both thermal-cycling survival and vibration resistance without requiring separate specialized components.
3Ease of manufacture
If conventional rigid PCB is used, then ease of manufacture is improved, but stress on conductors from thermal expansion increases
Solution Approach 1:
The patent replaces rigid PCB with flexible printed circuit boards that can be manufactured using similar printing and lamination processes, maintaining ease of manufacture. The FPC's inherent flexibility allows it to deform with thermal expansion and contraction of the sensing element, significantly reducing stress on conductors and connections compared to rigid PCB while still enabling mass production.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the survival and time to failure of the sensor by reducing stresses and preventing material movement, while allowing for better material choices and production techniques, thus improving fatigue life under thermal-cycling and vibration.
Implementation Method 1
the spring clip may be configured to absorb one or more of expansion and contraction deformation
Implementation Method 2
The spring clip and the sensing element may be connected using one or more of welding, soldering, or crimping
Data Source
AI summary
Embodiments of the present disclosure are directed towards various sensing devices. Embodiments may include an external housing and at least one conductor located included within and extending through an opening of the external housing. Embodiments may further include a spring clip included within the external housing and connected to the at least one conductor and a sensing element included within the external housing and connected to the spring clip.