Spring Mechanism for Temperature Sensor Mounting in Induction Cooktops
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Solution Overview
Problem
Conventional induction cooktops face limitations in efficiently heating cookware across the entire top surface without restrictions on pan position, and there is a need for improved mechanical strength and manufacturing economy in induction coil assemblies.
Innovation Solution
The induction cooktop assembly features a flexible induction coil arrangement with plasto-ferritic foils and support beams, integrated temperature sensors, and a spring mechanism to ensure consistent contact with the cooking surface, allowing for 'cook anywhere' functionality and improved structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a rigid temperature sensor mounting structure is used, then assembly precision is improved, but mechanical strength and stress resistance deteriorate
Solution Approach 1:
The patent changes the physical state of the mounting structure from rigid to flexible by using a spring mechanism. This flexible mounting structure maintains precise positioning of the temperature sensor while accommodating mechanical stress and movement in the coil assembly, thereby resolving the contradiction between mounting precision and mechanical strength.
Solution Approach 2:
The spring mechanism acts as a cushioning element that anticipates and absorbs mechanical stress before it reaches the temperature sensor. This pre-cushioning approach protects the sensor mounting from stress while maintaining positional precision, addressing both the precision and strength requirements.
2Ease of manufacture
If multiple separate components are used for coil assembly, then ease of manufacture is improved, but device complexity increases
Solution Approach 1:
The patent merges the temperature sensor mounting structure with the coil assembly by integrating a spring mechanism directly into the coil former or support structure. This consolidation reduces the number of separate components while maintaining ease of manufacture, as the integrated structure can be produced as a single piece or pre-assembled unit.
Solution Approach 2:
The spring mechanism serves multiple functions: it provides mechanical support for the temperature sensor, absorbs stress, maintains contact pressure, and accommodates assembly tolerances. This multi-functionality reduces the need for separate dedicated components, simplifying the overall device structure while maintaining manufacturing ease.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heating efficiency by evenly distributing electromagnetic energy across the cooking surface, maintains consistent contact with the cooktop, and reduces manufacturing defects and assembly stress, resulting in improved performance and economic production.
Implementation Method 1
Induction cooktops are devices which exploit the phenomenon of induction heating for food cooking purposes.
Implementation Method 2
The substrate forms an integral spring mechanism in connection with the temperature sensor
Data Source
AI summary
An induction cooking apparatus includes an induction coil forming a top surface and a bottom surface. The induction coil includes a plurality of conductive windings. A temperature sensor protrudes through the top surface of the induction coil. An electrical circuit is in communication with the temperature sensor. The electrical circuit is disposed on a substrate, which may form a chassis configured to support a plurality of conductive connections. The substrate forms a spring mechanism in connection with the temperature sensor.