Sensor Stack With PVD Decorative Feature
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Solution Overview
Problem
Integrating capacitive touch sensors into mechanical switches or buttons is challenging due to compatibility issues with thick materials and decorative elements, which hinder seamless integration with touch sensor forming processes.
Innovation Solution
A method involving physical vapor deposition to affix a decorative feature on a substrate, bonding a silicon layer with a capacitive touch sensor, and thinning the substrate and silicon layer to create a sensor stack that can be integrated into electronic devices, such as buttons, enabling touch-sensitive surfaces and fingerprint recognition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional thick materials are used for buttons, then structural integrity is maintained, but integration with capacitive touch sensors becomes difficult
Solution Approach 1:
The button structure is divided into multiple thin layers (substrate layer, intermediate layer, decorative layer) that can be separately manufactured and then bonded together. This segmentation allows each layer to be optimized independently - the substrate provides structural integrity while the thin overall structure enables capacitive sensor integration
Solution Approach 2:
The invention uses composite material structures combining different materials (substrate material, intermediate material, decorative material) with complementary properties. The substrate layer provides mechanical strength, while the thin composite structure enables electrical field penetration for capacitive sensing, resolving the contradiction between structural integrity and sensor integration
2Shape
If decorative elements are added to buttons, then aesthetic appeal is improved, but compatibility with touch sensor forming processes deteriorates
Solution Approach 1:
The decorative layer is separated into its own distinct layer in the multi-layer structure, allowing it to be manufactured independently using appropriate decorative techniques while the underlying substrate and intermediate layers maintain compatibility with capacitive sensor formation processes
Solution Approach 2:
The decorative elements are placed in a separate spatial layer above the sensor-active layers. This dimensional separation allows decorative features to be added without interfering with the electrical field distribution and sensor forming processes in the lower layers
3Measurement precision
If substrate and silicon layer are thinned, then touch sensitivity is enhanced, but structural strength may be compromised
Solution Approach 1:
The structure is segmented into multiple layers where the substrate layer and intermediate layer together provide mechanical strength while the thinned overall structure enhances touch sensitivity. The intermediate layer specifically bridges the gap between the decorative layer and sensor layer, maintaining structural integrity despite thinning
Solution Approach 2:
The multi-layer composite structure allows different materials to be optimized for different functions - the substrate and intermediate materials provide structural support while the thinned configuration enables enhanced capacitive coupling and touch sensitivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the successful integration of capacitive touch sensors into buttons and other input elements, enhancing touch sensitivity and reliability while maintaining structural integrity, and enabling fingerprint recognition.
Implementation Method 1
affixing, by physical vapor deposition, a decorative feature on a substrate formed from a sapphire material
Data Source
AI summary
Apparatuses and methods for creating a sensor stack or element for use in an electronic device. In one example, a method may include providing a substrate made of sapphire; affixing, by physical vapor deposition, a decorative feature on the substrate; providing a silicon layer including a capacitive sensor; and bonding the sensor to the substrate. In one example, the affixing operation may include an icon, logo, symbol or other graphic as the decorative feature. The method may also include reducing the substrate or silicon layer from an initial thickness to a second thickness, the second thickness being thinner that the initiation thickness. The sensor stack may be used or configured as an input button for the electronic device such as a mobile phone, tablet computer, or other computing device.