Image Sensor Substrate Reinforcement for Deformation Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High-resolution image sensor modules in digital devices face poor sensitivity due to deformation of the module substrate during assembly, which affects their ability to accurately convert image information into electrical information.
Innovation Solution
A substrate structure for image sensor modules is enhanced with a reinforcing plate on the lower surface covering the sensor mounting hole and a reinforcing pattern extending around it, which improves the backside strength without structural changes to the module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the module substrate is assembled into a digital device, then the image sensor module can be integrated and used, but the module substrate deforms and damages due to force on the lower surface, causing poor sensitivity
Solution Approach 1:
The substrate structure is segmented into multiple functional layers: a module substrate, a reinforcing plate, and a reinforcing pattern. This segmentation allows each layer to perform its specific function - the module substrate provides the base structure, while the reinforcing plate and pattern specifically address the backside strength issue without affecting the overall integration
Solution Approach 2:
The substrate structure employs a composite construction combining the module substrate with a reinforcing plate and reinforcing pattern. This composite structure integrates materials with different mechanical properties to achieve both flexibility for assembly and sufficient backside strength to prevent deformation and sensitivity loss
2Strength
If a reinforcing plate and reinforcing pattern are added to improve backside strength, then substrate deformation is minimized, but the structural complexity increases
Solution Approach 1:
The reinforcing pattern is applied locally around the sensor mounting hole rather than uniformly across the entire substrate. This localized reinforcement provides the necessary backside strength exactly where the sensor chip requires support, while minimizing the addition of structural complexity to areas that do not need reinforcement
Data Source
AI summary
A substrate structure for an image sensor module includes a module substrate including a sensor mounting hole, a reinforcing plate on a lower surface of the module substrate, an image sensor chip on the reinforcing plate within the sensor mounting hole, and a reinforcing pattern in the module substrate. The reinforcing plate covers the sensor mounting hole. An upper surface of the image sensor chip may be exposed by the module substrate. The reinforcing pattern is adjacent to the sensor mounting hole and extends in at least one direction.