Sensor Substrate for Electromagnetic Position Detection

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Solution Overview

Problem

Conventional electromagnetic-induction type position sensors face challenges in identifying short-circuit failures between conductor patterns during manufacturing, which can lead to defects and increased costs due to difficulty in detection using standard inspection devices.

Innovation Solution

A sensor substrate with a multi-layered structure and insulating material, where each coil is composed of alternating sub-coils connected in series, allowing for easy identification of short-circuit failures and subsequent connection using external conductors, eliminating the need for resistance and inductance measurements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If conductor patterns are manufactured by printed-board manufacturing technique, then manufacturing ease is improved, but short-circuit failure identification becomes difficult

Engineering Contradiction:
Improvemanufacturing easeVSAvoidshort-circuit failure identification
Core Design Contradiction:
Ease of manufactureVSDifficulty of detecting and measuring

Solution Approach 1:

The coil is divided into two separate sub-coils (first sub-coil and second sub-coil) that are formed in different layers of the printed board. This segmentation allows each sub-coil to be independently inspected for short-circuit failures using standard printed-board inspection devices, resolving the detection difficulty while maintaining manufacturing ease through conventional PCB techniques.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The conductor patterns of the first sub-coil and second sub-coil are arranged in different layers (vertical dimension) rather than adjacent in the same layer (horizontal dimension). This dimensional separation enables standard 2D inspection devices to effectively detect short-circuits in each sub-coil without the interference of adjacent patterns, while still allowing electrical connection between layers through vias.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Device complexity

If standard inspecting device is used, then inspection process is simplified, but short-circuit failure detection capability is insufficient

Engineering Contradiction:
Improveinspection process complexityVSAvoiddefect detection accuracy
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

By segmenting the coil into two sub-coils in different layers, the invention enables use of standard printed-board inspection devices that can effectively detect short-circuits in each sub-coil independently, achieving reliable defect detection without requiring complex specialized inspection equipment.

Inventive Principle:
Principle #1Segmentation

3Measurement precision

If resistance and inductance measurement is performed, then short-circuit detection capability is improved, but manufacturing process complexity increases

Engineering Contradiction:
Improveshort-circuit detection capabilityVSAvoidmanufacturing process complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The segmentation of the coil into two sub-coils in different layers enables detection of short-circuit failures using standard printed-board inspection devices during the manufacturing process, eliminating the need for additional resistance and inductance measurement steps while maintaining effective defect detection.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Facilitates early detection and prevention of short-circuit failures, reducing manufacturing costs and ensuring accurate assembly without adding new processes, thereby enhancing the reliability and efficiency of the sensor production.

Implementation Method 1

a plurality of coils which receive AC magnetic fluxes and outputs electromagnetic induction voltages whose phases of amplitude change are different from each other

Methodology Applied
Scientific EffectElectromagnetic induction: Electromagnetic Induction

Data Source

PatentUS11169005B2Sensor substrate for electromagnetic-induction type position sensor and method of manufacturing sensor substrate
Publication Date: 2021.11.09 OKUMA CORP
  • US11169005B2 patent drawing

AI summary

A sensor substrate includes a multi-layered substrate and a plurality of coils formed on the substrate, an upper-side coil includes a first sub coil including a plurality of conductor patterns connected in series with each other in the substrate, and a second sub coil including a plurality of conductor patterns connected in series with each other in the substrate, and in any of the even number of layers, the conductor pattern belonging to the first sub coil and the conductor pattern belonging to the second sub coil are aligned alternately in a planar direction, and one end of the first sub coil is connected to one terminal of a short land, while one end of the second sub coil is connected to the other terminal of the short land separated from the one terminal in the planar direction.