Sensor Substrate Gap Measurement at Semiconductor Process Conditions
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current gap measurement tools in semiconductor manufacturing are limited by their environmental operating range and require venting the processing chamber, leading to inaccurate measurements and increased downtime due to calibration, which can cause damage to substrate supports.
Innovation Solution
A sensor substrate with sensors on both sides and an image capture device is used to measure gaps and parallelism without contacting the substrate support, allowing accurate measurements at process conditions and reducing calibration time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If current gap measurement tools are used, then measurements can be taken, but the chamber must be vented which increases equipment downtime and reduces measurement accuracy
Solution Approach 1:
A sensor substrate is introduced as an intermediary component that can be positioned between the substrate support and the showerhead/sputtering target. This sensor substrate carries the gap measurement tools, allowing them to operate within the processing chamber at process conditions without requiring venting, thus resolving the contradiction between measurement accuracy and equipment downtime
Solution Approach 2:
The measurement system is modified to operate at process conditions (temperature, pressure) rather than requiring vented conditions. By changing the operational parameters to match actual processing conditions, the system achieves both accurate measurements and eliminates downtime associated with venting and recalibration
2Measurement precision
If measurement tools contact the substrate support, then measurements can be taken, but damage to the substrate support may occur
Solution Approach 1:
The sensor substrate serves as a mediator that carries the measurement tools away from direct contact with the substrate support. The sensors measure gaps from the sensor substrate position rather than from the substrate support surface, eliminating the harmful contact while preserving measurement capability
Solution Approach 2:
Instead of directly measuring from the substrate support, the system uses a sensor substrate as a copy or surrogate position reference. The gap measurements are taken relative to this sensor substrate, which then translates to the actual substrate processing gap, avoiding direct contact damage
Data Source
AI summary
Methods, systems, and apparatus for measuring a gap between a support surface for a substrate and an opposing upper surface of a processing chamber. The methods comprise: disposing a sensor substrate at a location spaced between the support surface and the upper surface, the sensor substrate comprising a body having a first side and a second side opposite the first side, the first side facing the support surface and the second side facing the upper surface, the first side having a first sensor and the second side having a second sensor; measuring, using the first sensor, a first distance between the first side and the support surface; measuring, using the second sensor, a second distance between the second side and the upper surface; and determining a gap between the support surface and the upper surface using the first distance and the second distance.