Sensor Substrate Microprotrusions Metal Film Adhesive Slits
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Solution Overview
Problem
Existing sensor substrates fail to detect analytes with high sensitivity and reliability, particularly due to issues like damage to the detection recess, adhesive flow into the sensor, and denaturation of biomaterials during the curing process.
Innovation Solution
A sensor substrate design featuring a first substrate with microprotrusions covered by a metal film, an adhesive film with slits, and a transparent second substrate with through holes, which allows for high-sensitive detection without compromising light-transmitting properties and adhesion, and eliminates the need for adhesive curing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a compact-disc-shaped microchip with centrifugal flow is used, then the device structure is simplified, but the detection sensitivity and reliability decrease
Solution Approach 1:
The device is divided into functionally independent modules: a sensor substrate with detection elements, a separate sample introduction system, and distinct flow control components. This segmentation allows each module to be optimized independently, maintaining simplicity while improving detection reliability through specialized functional zones.
Solution Approach 2:
An adhesive film with precisely controlled slits acts as an intermediary element between the sensor substrate and sample introduction system. This intermediary controls fluid flow through the slits, enabling reliable analyte delivery to detection zones without direct contact between potentially contaminating components.
2Strength
If adhesive is used to bond substrates, then strong adhesion is achieved, but adhesive may flow into the sensor and damage biomaterials during curing
Solution Approach 1:
The adhesive film features locally differentiated properties: slits are positioned and sized to permit controlled fluid flow to detection zones while preventing adhesive extrusion into sensor areas. The adhesive material itself is selected to bond effectively without requiring aggressive curing conditions that would damage biomaterials.
Solution Approach 2:
The potential harmful effect of adhesive flow is converted into a beneficial flow control mechanism. The slits in the adhesive film, which could potentially allow adhesive leakage, are instead designed to guide sample fluid flow precisely to detection zones, turning a potential defect into a functional feature.
3Reliability
If a metal film is deposited on microprotrusions to enhance detection, then detection sensitivity improves, but light-transmitting properties may be compromised
Solution Approach 1:
The metal film is applied selectively only to the microprotrusions that serve as detection elements, rather than covering the entire substrate. This localized metallization provides enhanced detection sensitivity at specific sensing points while leaving other areas transparent for light transmission and optical detection.
Solution Approach 2:
The detection enhancement is achieved by adding vertical dimension (metal film thickness on microprotrusions) rather than horizontal expansion. The microprotrusions with metal coating create three-dimensional sensing structures that enhance detection without blocking the optical path in the horizontal plane.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the detection of low-concentration analytes with enhanced sensitivity and reliability, preventing damage to the substrate and maintaining the integrity of biomaterials, while reducing liquid leakage and improving antigen-antibody reaction efficiency.
Implementation Method 1
a first substrate having first microprotrusions provided on the surface thereof and covered by a metal film
Data Source
AI summary
The present disclosure provides a sensor substrate that detects an analyte of a low concentration with high sensitivity and high reliability. The sensor substrate according to the present disclosure a first substrate having first microprotrusions provided on the surface thereof and covered by a metal film, an adhesive film disposed on the surface of the first substrate and having a slit, and a second substrate that is transparent, disposed on the adhesive film, and having a first through hole and a second through hole, wherein each of the first through hole and the second through hole is in communication with the slit, and the first microprotrusions overlap the slit in a plan view.


