Hermetically Sealed Sensor Substrate with Optically Transmissive Vias
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Solution Overview
Problem
Existing implantable sensor systems face challenges in maintaining hermeticity between sensors exposed to fluids and electronics, leading to potential short circuits and the need for frequent recalibration, particularly in applications like glucose monitoring in diabetics and oxygen sensing in heart conditions.
Innovation Solution
A hermetically sealed substrate with vias filled with optically transmissive and electrically conductive materials, such as fritted glass and indium tin oxide, allows for close proximity of sensing elements to electronics while preventing fluid exposure, ensuring long-term accuracy and reducing drift.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If sensor electronics are placed in close proximity to the sensor, then signal accuracy and system stability are improved, but the electronics are exposed to bodily fluids which causes short circuits and system failure
Solution Approach 1:
The device is divided into two distinct sides: a first side for the sensing element exposed to bodily fluids, and a second side for electronics protected from fluids. This segmentation allows each component to be optimally positioned for its function while protecting the electronics from harmful fluid exposure.
Solution Approach 2:
A hermetic seal structure acts as an intermediary barrier between the sensing element and electronics. This seal includes a sealed region with a first opening for the sensing element and a second opening for the electronics, creating a protected interface that prevents fluid contact while maintaining signal integrity.
2Reliability
If the sensor is hermetically sealed to protect electronics, then electrical safety is improved, but manufacturing complexity and calibration requirements increase
Solution Approach 1:
The hermetic seal structure combines multiple functions into a single integrated component: it provides electrical isolation, mechanical support, and fluid barrier protection simultaneously. This merging reduces the number of separate components needed and simplifies the manufacturing process.
Solution Approach 2:
The sealed region serves multiple purposes: it protects electronics from fluids, provides a mounting structure for both the sensing element and electronics, and maintains hermetic separation while allowing controlled interfaces for signal transmission.
3Duration of action of moving object
If the sensor remains in the body for extended periods, then patient convenience is improved, but sensor drift and calibration needs increase
Solution Approach 1:
The sensing element and electronics are pre-assembled and hermetically sealed together in a controlled manufacturing environment before implantation. This preliminary assembly ensures proper alignment and calibration are established once, eliminating the need for repeated recalibration during extended implantation periods.
Solution Approach 2:
The hermetic seal maintains continuous protection of the electronics throughout the entire implantation period, ensuring stable electrical connections and preventing degradation that would require recalibration. This continuous protection enables long-term operation without maintenance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a stable and accurate sensor system with reduced drift, allowing for extended implantation periods without recalibration, maintaining hermeticity and preventing electronic damage from fluids.
Implementation Method 1
The at least one via may be at least partially filled with an optically transmissive material
Implementation Method 2
The at least one via may be hermetically sealed from the first side of the substrate to the second side of the substrate
Data Source
AI summary
A sensing apparatus may include a substrate having a first side for a sensing element and a second side for electronics, the substrate may have a at least one via from the first side of the substrate to the second side of the substrate, the at least one via may be hermetically sealed with an optically transmissive material.