Sensor Substrate Inorganic Particle Wiring Conductor Thermal Shock
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Solution Overview
Problem
The existing sensor substrates with ceramic sintered bodies and metal wiring conductors are prone to deformation and increased resistance due to thermal shock, as the wiring conductor infiltrates into the glass insulating substrate, leading to a narrow contact area and resistance changes.
Innovation Solution
The sensor substrate features an insulating substrate with inorganic particles and glass, where the inorganic particles contact the wiring conductor, and glass is positioned between the particles and the conductor, creating a larger contact area between the particles and the conductor, thereby reducing the likelihood of deformation and resistance changes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the contact portion between glass and wiring conductor is large, then the wiring conductor is securely attached to the insulating substrate, but the wiring conductor infiltrates into the glass under thermal shock, causing deformation and increased resistance
Solution Approach 1:
The patent applies local quality by creating different contact characteristics in different regions of the insulating substrate. The inorganic particle layer is selectively positioned at the contact portion between the glass and wiring conductor to provide localized reinforcement. This allows the glass to maintain good attachment strength where needed while preventing infiltration at critical interfaces, thereby resolving the contradiction between secure attachment and resistance stability under thermal shock conditions
2Ease of manufacture
If the wiring conductor is in direct contact with glass, then the manufacturing process is simple, but thermal shock causes the wiring conductor to deform and form narrow portions, increasing resistance
Solution Approach 1:
The patent introduces an inorganic particle layer as an intermediary substance between the glass and wiring conductor. This intermediate layer acts as a buffer that prevents direct contact and potential infiltration while maintaining electrical connectivity. The inorganic particles provide a stable interface that protects the wiring conductor from deformation under thermal shock, ensuring uniform cross-sectional area and stable resistance without significantly complicating the manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the accuracy of temperature detection by minimizing wiring conductor deformation and resistance changes, even under thermal shock conditions, ensuring reliable and precise temperature measurement.
Implementation Method 1
if the temperature of various exhaust combustion gases was detected and the temperature rises rapidly with thermal shock applied
Implementation Method 2
the glass is disposed at a position between the plurality of inorganic particles and the wiring conductor
Data Source
AI summary
A sensor substrate includes an insulating substrate including a plurality of inorganic particles formed of an insulator in contact with each other and glass, and a wiring conductor disposed on the insulating substrate. The plurality of inorganic particles and the glass are in contact with the wiring conductor, and the glass is disposed at a position between the plurality of inorganic particles and the wiring conductor, and a contact portion between the plurality of inorganic particles and the wiring conductor is larger than a contact portion between the glass and the wiring conductor in a longitudinal sectional view.