Sensor Device Wiring Substrate Regulation Part Deformation
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Solution Overview
Problem
Existing sensor devices face challenges in miniaturization and cost reduction due to the limitations of the mounting method, which requires a larger footprint for the gyrosensor and IC, and the miniaturization of the gyrosensor is restricted, limiting the number of pieces that can be produced and increasing costs.
Innovation Solution
A sensor device with a wiring substrate that includes a first joint surface electrically joined with the sensor element, a substrate body containing an organic insulator and an embedded electronic component, and a regulation part that suppresses deformation of the joint surface, allowing for stable sensor characteristics and miniaturization, along with a shield part for electromagnetic protection and handling improvements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the gyrosensor is mounted by stepping over a recess part (housing part) on the wiring substrate, then the footprint can be reduced, but the gyrosensor length must be longer than the housing part in either horizontal or vertical direction, limiting miniaturization
Solution Approach 1:
The patent transitions from planar mounting to three-dimensional stacked mounting. The gyrosensor is mounted directly on the upper surface of the wiring substrate without stepping over a recess, and the housing part is formed to extend upward to cover the gyrosensor. This vertical stacking approach reduces the footprint while allowing the gyrosensor to be smaller in all dimensions, resolving the contradiction between footprint reduction and gyrosensor miniaturization.
2Productivity
If the gyrosensor miniaturization is limited by the mounting method, then the number of pieces that can be produced from one wafer is reduced, but cost reduction is achieved through increased production volume
Solution Approach 1:
The patent separates the housing function from the mounting structure. The housing part is formed as a separate molded component that extends upward from the wiring substrate to cover the gyrosensor, rather than being an integrated recess in the substrate. This segmentation allows the gyrosensor to be miniaturized independently and mounted in a simpler direct surface-mount process, increasing the number of pieces that can be produced from one wafer while reducing manufacturing complexity.
3Reliability
If the organic insulator in the substrate body deforms due to heat or vibration, then the joint surface structure is affected, but the regulation part suppresses this deformation to maintain stable sensor characteristics
Solution Approach 1:
The patent introduces a regulation part as an intermediary component between the organic insulator substrate body and the joint surface where the gyrosensor is mounted. This regulation part suppresses the deformation of the joint surface caused by thermal expansion or vibration of the organic insulator, thereby maintaining stable sensor characteristics while allowing the use of cost-effective organic insulator materials in the substrate body.
Data Source
AI summary
A sensor device includes a sensor element; and a wiring substrate having a first joint surface electrically joined with the sensor element, a substrate body that contains an organic insulating material and in which an electronic component is embedded, and a regulation part that regulates the first joint surface from deforming.