Sensor Package Substrate Step Part Anti-Dust Filter Mounting
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Solution Overview
Problem
Existing sensor modules face challenges in stably fixing anti-dust filters inside through holes, leading to difficulties in controlling attachment positions and preventing filter detachment.
Innovation Solution
A sensor package substrate with a through hole featuring a step part for mounting the anti-dust filter, ensuring secure positioning and preventing detachment, while allowing for adjustable detection characteristics and enhanced sound collection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If an anti-dust filter is fixed by simply using an adhesive, then it can be mounted inside the through hole, but it is difficult to control the attachment position and the filter may fall off
Solution Approach 1:
The through hole is divided into two sections with different diameters, creating a step part that segments the mounting space. This segmentation provides a physical stop that prevents the filter from moving or falling off, while still allowing simple adhesive mounting.
Solution Approach 2:
The step part acts as an intermediary structure between the through hole and the anti-dust filter. It provides a stable mounting surface and positional reference, enabling reliable filter fixation without complex adhesive application techniques.
2Object-affected harmful factors
If a porous film is disposed inside the through hole to prevent mixture of foreign matter, then foreign matter protection is improved, but it is not easy to stably fix the anti-dust filter
Solution Approach 1:
The through hole is segmented into two sections with different diameters, creating a step part that provides a stable mounting surface for the anti-dust filter. This segmentation enables reliable fixation while maintaining the filter's protective function against foreign matter.
3Device complexity
If the through hole has a uniform diameter, then the structure is simple, but it cannot provide stable positioning for the anti-dust filter
Solution Approach 1:
The through hole is segmented into two sections with different diameters. This creates a step part that provides precise positioning for the filter while maintaining relative structural simplicity. The segmentation achieves both positioning accuracy and ease of manufacture.
Solution Approach 2:
The through hole structure transitions from uniform to non-uniform by creating a step part with different diameters in different sections. This local variation in geometry provides the necessary positioning function without making the entire structure complex.
Data Source
AI summary
Disclosed herein is a sensor package substrate that includes a first mounting area for mounting a sensor chip. The sensor package substrate has a through hole formed at a position overlapping the first mounting area in a plan view so as to penetrate the sensor package substrate from one surface to the other surface. The through hole includes a first section having a first diameter and a second section having a second diameter smaller than the first diameter. A step part inside the through hole positioned at a boundary between the first and second sections constitutes a second mounting area for mounting an anti-dust filter.