Sensor Substrate for Wafer Profile Measurement
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Solution Overview
Problem
Current semiconductor manufacturing processes face challenges in accurately and efficiently training robots for precise substrate placement and measuring wafer profiles, leading to time-consuming and costly manual operations and the need for additional equipment.
Innovation Solution
The integration of sensor modules with capacitive, laser, and interferometer sensors into substrates and support surfaces within semiconductor processing tools, enabling fast and accurate distance sensing and wafer bow measurement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If manual operation is used for robot training, then the robot can be trained for substrate transfer, but the process is time-consuming and costly
Solution Approach 1:
The patent replaces manual mechanical positioning operations with an automated optical measurement system. Sensors (cameras, laser scanners) capture substrate positions automatically, and software algorithms process the data to train the robot, eliminating the need for manual operation while achieving high precision.
2Measurement precision
If dedicated scanners are used to measure wafer profiles, then accurate wafer bow and warpage measurements can be obtained, but additional equipment is required which decreases throughput and increases costs
Solution Approach 1:
The patent merges the wafer profile measurement function with the existing robot positioning system. The same sensors used for robot training are also used to measure wafer bow and warpage, eliminating the need for dedicated scanning equipment and maintaining high throughput while achieving accurate measurements.
Solution Approach 2:
The measurement system is designed to perform multiple functions: robot positioning calibration and wafer profile measurement. This multi-functional approach allows a single system to replace both manual training operations and dedicated scanning equipment, improving productivity while maintaining measurement precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for rapid and precise robot training and wafer profile measurement, increasing throughput and reducing costs by eliminating the need for manual operations and dedicated scanning equipment.
Implementation Method 1
the sensors include capacitive sensors, which may be used for measuring accurate and precise distances between objects
Implementation Method 2
the sensors include laser sensors, which may be used for measuring accurate and precise distances between objects
Implementation Method 3
the sensors include interferometer sensors, which may be used for measuring accurate and precise distances between objects
Data Source
AI summary
Embodiments disclosed herein include sensor modules. In an embodiment, a module comprises a substrate with a first surface, a second surface opposite from the first surface, and a sidewall surface coupling the first surface to the second surface. In an embodiment, a plurality of sensors are provided around a perimeter of the substrate. In an embodiment, the sensors are configured to measure distances between the sidewall surface and an external object. In an embodiment, the module further comprises a processor communicatively coupled to the plurality of sensors.