Overlapping Sensor Substrates for Heat-Safe Soldered Measurement
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Solution Overview
Problem
Existing physical quantity measurement apparatuses face challenges in miniaturization due to the space required by pin headers and insulating portions, leading to thermal and mechanical issues that degrade measurement accuracy when soldering is performed near the sensing part.
Innovation Solution
A physical quantity measurement apparatus is designed with a first substrate having a sensing part on its front surface and a surface electrode on its back surface, electrically connected to a side electrode on a second substrate, allowing for overlap and avoiding direct exposure to high temperatures during soldering, thus maintaining measurement accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If pin headers are used for electrical connection between substrates, then reliable electrical connection is achieved, but further miniaturization becomes difficult due to space required by insulating portions
Solution Approach 1:
The invention extracts and eliminates the pin header component from the connection structure. Instead of using pin headers with insulating portions, the patent uses direct soldering of side electrodes to lands on the circuit board, removing the unnecessary insulating portions and achieving miniaturization while maintaining electrical connection functionality
Solution Approach 2:
The invention transitions from a conventional top-down connection approach to a side-dimension connection approach. By forming side electrodes on the side surface of the circuit board and connecting them to lands on the side face, the patent utilizes the vertical dimension for electrical connection, thereby eliminating the need for insulating portions between pin headers and enabling compact design
2Ease of manufacture
If soldering is performed near the sensing part, then electrical connection is achieved, but the sensing part or area near it is exposed to high temperatures which changes its characteristics
Solution Approach 1:
The invention segments the circuit board into distinct functional zones: a sensing part area where the sensing part is mounted, and a connection area where side electrodes are formed. This spatial segmentation ensures that soldering operations are confined to the connection area, isolating the sensing part from thermal exposure and preserving measurement precision while enabling standard soldering manufacturing processes
Solution Approach 2:
The side electrodes serve as intermediaries between the sensing part and external connections. By positioning side electrodes away from the sensing part and using them as the soldering interface, the invention creates a thermal buffer zone that protects the sensing part from direct heat exposure during soldering, maintaining its characteristics and measurement accuracy
3Ease of manufacture
If soldering is performed near the sensing part, then electrical connection is achieved, but vaporized flux may adhere to the sensing part and change its characteristics
Solution Approach 1:
The invention segments the circuit board into distinct functional zones: a sensing part area where the sensing part is mounted, and a connection area where side electrodes are formed. This spatial segmentation ensures that soldering operations are confined to the connection area, isolating the sensing part from thermal exposure and preserving measurement precision while enabling standard soldering manufacturing processes
Solution Approach 2:
The side electrodes serve as intermediaries between the sensing part and external connections. By positioning side electrodes away from the sensing part and using them as the soldering interface, the invention creates a thermal buffer zone that protects the sensing part from direct heat exposure during soldering, maintaining its characteristics and measurement accuracy
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves high measurement accuracy by preventing thermal and mechanical damage to the sensing part, enabling miniaturization and reducing the risk of flux adhesion, while allowing for automated soldering and component arrangement flexibility.
Implementation Method 1
the sensing part includes a light emitting element and a detection element that detects an amount of absorption, by the object to be measured, of light emitted from the light emitting element
Data Source
AI summary
A physical quantity measurement apparatus capable of measuring with high accuracy is provided. A physical quantity measurement apparatus (1) includes a first substrate (10) and a second substrate (20) and measures a physical quantity of an object to be measured. The first substrate includes a sensing part (13) on a front surface (10a) and a surface electrode on a back surface, the sensing part being configured to output a signal according to the physical quantity. The second substrate includes a side electrode. When the first substrate is viewed from a direction perpendicular to the front surface or the back surface of the first substrate, at least a portion of the first substrate overlaps the second substrate. The surface electrode is electrically connected to the side electrode.