Semiconductor Pressure Sensor Dedicated Support Interface
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Solution Overview
Problem
Semiconductor pressure sensors are challenging to manufacture and mount due to their miniaturized dimensions and fragility, complicating the production of pressure sensor devices, especially when detecting liquid pressures, which requires complex sealed insulation to prevent damage.
Innovation Solution
A semiconductor pressure sensor with a dedicated support that serves as a mechanical, hydraulic, and electrical interface, allowing for easier mounting and automation, and can adapt to different sensor types, eliminating the need for traditional printed circuit boards and simplifying the assembly process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If semiconductor pressure sensors are used due to their miniaturized dimensions, then the device size is reduced, but the mounting difficulty and fragility increase
Solution Approach 1:
The patent introduces a support structure as an intermediary component between the semiconductor pressure sensor and the device housing. This support serves as a mediator that simplifies mounting operations by providing a larger handling surface and integration interface, while the sensor itself remains miniaturized. The support structure enables automated mounting processes despite the sensor's small size and fragility.
2Volume of moving object
If semiconductor pressure sensors are used, then the device size is reduced, but the production complexity increases
Solution Approach 1:
The patent combines multiple functions into the support structure: mechanical support, electrical connection carrier, and mounting interface. By merging these functions into a single component rather than using separate elements, the overall production complexity is reduced despite using miniaturized semiconductor sensors. The integrated support structure simplifies assembly operations and enables standardized production processes.
3Ease of manufacture
If traditional printed circuit boards are used for mounting sensors, then the assembly process is standardized, but the device size increases
Solution Approach 1:
The support structure is designed as a universal mounting platform that can accommodate different sensor types (semiconductor and monolithic) while maintaining standardized assembly processes. This multi-functional support eliminates the need for separate mounting solutions for different sensor types, achieving both size reduction and assembly standardization through a single integrated component.
4Measurement precision
If semiconductor pressure sensors are used for liquid pressure detection, then the device precision is improved, but the sealing complexity increases to prevent damage
Solution Approach 1:
The support structure serves as a mediator between the semiconductor pressure sensor and the liquid environment. It provides integrated sealing functionality that protects the fragile sensor from direct exposure to liquid while maintaining measurement precision. The support structure simplifies the sealing arrangement by consolidating protection functions into a single component rather than requiring multiple separate sealing elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables easier, more reliable, and flexible semiconductor pressure sensor manufacturing and mounting, reducing the risk of component damage and improving accuracy, while allowing for standardization of both semiconductor and monolithic sensors on the same assembly line.
Implementation Method 1
An electrical detection component, capable of generating a signal representing a flexure of the membrane portion 4, is provided for at the membrane portion 4; the components used for such purpose are typically selected from among resistor elements, capacitive elements and piezo-resistive elements.
Data Source
AI summary
A semiconductor pressure sensor for a pressure sensor device has a pressure detection element which includes a membrane made of semiconductor material, particularly silicon. The sensor includes a support having a three-dimensional body passed through by a detection passage. The detection element is made integral with a first end face of the three-dimensional body, substantially at a respective end of the detection passage. The support is configured to serve the function of a mechanical and/or hydraulic adaptor or interface, with the aim of mounting the sensor into a pressure sensor device, particularly to allow mounting the pressure sensor into a pressure sensor device configured for mounting a sensor of the type referred to as monolithic or ceramic.