Sensor Device Support Profile Cavern Design
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Solution Overview
Problem
Existing hot-film mass airflow sensors face reduced stiffness and thermal stability due to openings in the support profile, leading to compromised electrical connections and limited assembly surface area, which restricts the complexity and functionality of evaluation circuits.
Innovation Solution
A sensor device with a support profile featuring a cavern to accommodate electronic components on the bottom side of the circuit carrier, maintaining structural integrity and thermal stability by allowing for a more complex evaluation circuit without compromising the assembly or electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If openings are provided in the bottom plate of the support profile to accommodate electronic components, then the assembly surface area is increased, but the stiffness of the construction is reduced and thermal stability decreases
Solution Approach 1:
The invention transitions from a two-dimensional surface mounting approach to a three-dimensional space utilization by creating a cavern (recess) within the support profile structure. This allows electronic components to be accommodated in the vertical dimension rather than requiring additional horizontal surface area, thereby maintaining the structural integrity and stiffness of the support profile while providing sufficient space for electronic components.
2Adaptability or versatility
If openings are provided in the bottom plate of the support profile, then electronic components can be accommodated, but the stability in alternating thermal stress load decreases
Solution Approach 1:
The invention embeds the electronic components within a cavern (recess) that is formed as an integral part of the support profile structure. This nesting approach allows the electronic components to be housed within the existing structural framework without creating openings that would compromise thermal stability. The cavern acts as a nested space within the support profile, maintaining the continuous material structure necessary for thermal stability while accommodating the electronic components.
3Device complexity
If the circuit board is assembled on both sides, then the evaluation circuit complexity is increased, but the installation space requirement remains the same
Solution Approach 1:
The invention utilizes the vertical dimension by creating a cavern (recess) within the support profile to accommodate electronic components that would otherwise require additional horizontal space. This allows for complex evaluation circuits with components on both sides of the circuit board to be integrated within the existing installation footprint, effectively using the third dimension to resolve the space constraint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cavern design enhances the structural stiffness and thermal stability of the support profile, preventing structural weakening and maintaining the longevity of electrical connections under alternating thermal stress, enabling more complex evaluation circuits and additional functions within a limited assembly space.
Implementation Method 1
hot-film mass airflow sensor
Data Source
AI summary
A sensor device for detecting at least one flow property of a fluid medium, in particular for detecting the air flow in the intake tract or the charge air tract of an internal combustion engine is provided. The sensor device has a sensor housing, which has an electronics chamber, an electronic module being situated at least partially in this electronics chamber. The electronic module has at least one support profile and at least one circuit carrier connected to the support profile. The circuit carrier carries at least one evaluation circuit. The sensor device is characterized in that electronic components are situated on the circuit carrier, on both a top side and a bottom side, and the support profile has a cavern which accommodates at least one electronic component situated on a bottom side of the circuit carrier.