Sensor Device Terminals Integrated with Chip Capacitors
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Solution Overview
Problem
Existing physical quantity sensor devices require a noise suppressing substrate for chip capacitors, incurring additional costs and necessitating complex assembly processes, including cutting terminals for trimming and property adjustment.
Innovation Solution
The integration of chip capacitors between adjacent terminals within the sensor device's housing, eliminating the need for a noise suppressing substrate and simplifying the assembly by avoiding terminal cutting processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a noise suppressing substrate is provided to attach chip capacitors, then electromagnetic compatibility is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent merges the noise suppressing function directly into the housing part by integrating chip capacitors between adjacent external lead terminals within the housing. This eliminates the need for a separate noise suppressing substrate, thereby reducing device complexity while maintaining electromagnetic compatibility through the same capacitive noise suppression mechanism.
Solution Approach 2:
The housing part is given multiple functions: it not only provides mechanical protection and structural support but also serves as a noise suppression element by housing chip capacitors between external lead terminals. This multi-functional design eliminates the need for dedicated noise suppressing substrates, reducing overall device complexity.
2Reliability
If a noise suppressing substrate is provided, then electromagnetic compatibility is improved, but manufacturing cost increases
Solution Approach 1:
The patent combines the noise suppression function with the existing housing structure, eliminating the need for a separate noise suppressing substrate. This integration reduces the number of components and assembly steps, thereby lowering manufacturing costs while maintaining electromagnetic compatibility through chip capacitors placed between external lead terminals.
Solution Approach 2:
The patent extracts the noise suppression function from a separate substrate component and relocates it to be integrated within the housing structure itself. By taking out the need for a dedicated noise suppressing substrate and implementing noise suppression directly in the housing, manufacturing costs are reduced while maintaining the essential electromagnetic compatibility function.
3Adaptability or versatility
If terminals are cut for trimming and property adjustment, then device functionality is improved, but assembly complexity increases
Solution Approach 1:
The patent performs terminal trimming and property adjustment during the molding process itself, before final assembly. By preliminarily adjusting terminal lengths and properties in the mold, subsequent assembly operations are simplified, reducing overall assembly complexity while maintaining the necessary adaptability for property adjustment.
Solution Approach 2:
The patent replaces manual or post-assembly mechanical terminal cutting with an integrated molding process that automatically forms terminals with predetermined lengths and configurations. This substitution of mechanical post-processing with integrated molding reduces assembly complexity while preserving the ability to adjust terminal properties as needed.
Data Source
AI summary
A first connector pin to a third connector pin have a substantially L-shaped cross-sectional shape formed by a horizontal part embedded in the top of an inner housing part by resin molding and a vertical part continuous with and protruding upwardly orthogonal to the horizontal part. A fourth connector pin has a substantially I-shaped cross-sectional shape having only the vertical part. The horizontal part of the first connector pin is provided so as to surround the first end of the first connector pin, the horizontal part and the first end of the second connector pin, the horizontal part and the first end of the third connector pin, and is integrated and connected to the fourth connector pin. A chip capacitor is attached to the connector pins by a joining member. Thus, the connector pins are connected to each other via the chip capacitors.