Sensor Thermal Gradient Compensation via Housing Conduction

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Solution Overview

Problem

Existing differential pressure sensors face challenges in accurately measuring pressure across temperature gradients, as they are typically designed to assume both sides of the sensor are at the same temperature, making it difficult to compensate for temperature differences when one side is exposed to a hot liquid and the other to a cool gas.

Innovation Solution

A sensor assembly is configured with a housing that couples two transducers, each in a header, ensuring they operate at equivalent temperatures, allowing for effective temperature regulation and standard temperature compensation, thereby mitigating the impact of thermal gradients.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a half-bridge sensor configuration is used to measure differential pressure, then the sensor can operate in applications where different pressures are applied to opposite sides of the diaphragm, but the sensor becomes susceptible to temperature differences between the two sides

Engineering Contradiction:
Improvedifferential pressure measurement capabilityVSAvoidpressure measurement accuracy
Core Design Contradiction:
Adaptability or versatilityVSMeasurement precision

Solution Approach 1:

A thermally conductive housing acts as an intermediary thermal path between the two transducers, equalizing their temperatures. The housing material with high thermal conductivity creates a thermal bridge that mediates the temperature difference, allowing both transducers to operate at the same temperature despite being exposed to different pressure environments.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Ease of manufacture

If standard temperature compensation techniques are applied assuming both sensors are at the same temperature, then compensation can be implemented using conventional methods, but the compensation fails when temperature gradients exist across the sensor

Engineering Contradiction:
Improvetemperature compensation implementationVSAvoidtemperature compensation accuracy
Core Design Contradiction:
Ease of manufactureVSMeasurement precision

Solution Approach 1:

The housing design creates a thermal equipotential condition by ensuring both transducers operate at the same temperature. This eliminates temperature gradients and allows standard temperature compensation techniques to function effectively, as both sensors now experience identical thermal conditions.

Inventive Principle:
Principle #12Equipotentiality

3Device complexity

If the shell connecting the headers does not transfer heat efficiently, then the sensor structure remains simple, but large thermal gradients develop across the sensor body

Engineering Contradiction:
Improvethermal management structureVSAvoidthermal gradient magnitude
Core Design Contradiction:
Device complexityVSTemperature

Solution Approach 1:

The thermal conductivity parameter of the housing material is changed to a high value, transforming the housing from a simple structural component into an active thermal management element. This parameter change enables efficient heat transfer between transducers without adding complex active thermal control systems.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances the accuracy of pressure measurement by maintaining transducer temperatures within a narrow range, enabling effective temperature compensation and reducing the need for complex gradient characterization, which is difficult in production settings.

Implementation Method 1

the first transducer and the second transducer may be positioned in the housing such that a first temperature of the first transducer is about equivalent to a second temperature of the second transducer during operation of the sensor assembly

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10942076B2Sensor having thermal gradients
Publication Date: 2021.03.09 KULITE SEMICON PROD INC
  • US10942076B2 patent drawing
  • US10942076B2 patent drawing
  • US10942076B2 patent drawing

AI summary

The invention is an improved sensor assembly including a housing; a first header and a second header coupled to the housing; a first transducer coupled to the first header and a second transducer coupled to the second header. The first transducer is configured to measure a first pressure to generate a first pressure signal. The second transducer is configured to measure a second pressure to generate a second pressure signal. The first transducer and the second transducer are positioned in the housing such that a first temperature of the first transducer is about equivalent to a second temperature of the second transducer during operation of the sensor assembly.