Temperature Sensor Package Thermal Insulation Design
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Temperature sensors in electronic systems are affected by environmental changes such as convection currents and infrared radiation, leading to inaccurate temperature measurements due to lack of effective thermal insulation and conductivity.
Innovation Solution
A temperature sensor package with a circuit board that provides thermal insulation between the active region of the sensor and the environment, using a thermally conductive adhesive for direct coupling with the target area and optional stiffeners or insulative materials for enhanced insulation, facilitating accurate temperature sensing while minimizing design and manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the temperature sensor is exposed to the environment for direct temperature sensing, then the sensor can detect environmental temperature changes, but the sensor is affected by convection currents and infrared radiation leading to measurement inaccuracies
Solution Approach 1:
The temperature sensor package is segmented into distinct functional layers: the active sensing region is separated from the environment by an insulative layer, while a thermally conductive layer provides dedicated thermal pathways. This segmentation allows the sensor to reject environmental thermal interference while maintaining accurate measurement of the target object's temperature through controlled thermal coupling.
Solution Approach 2:
Different regions of the sensor package are assigned different thermal properties: the region facing the target object uses thermally conductive material to maximize heat transfer, while the region facing the environment uses thermally insulative material to minimize interference. This local differentiation of thermal conductivity optimizes measurement accuracy by enhancing desired thermal coupling while blocking unwanted environmental thermal effects.
2Measurement precision
If thermal insulation is added to protect the sensor from environmental influences, then measurement accuracy improves, but device complexity increases
Solution Approach 1:
Multiple functions are merged into a single integrated sensor package structure: the insulative layer and thermally conductive layer are combined in a stacked configuration around the temperature sensor, providing both environmental isolation and target thermal coupling simultaneously. This integration achieves accurate temperature measurement without requiring separate complex systems for insulation and thermal coupling.
Solution Approach 2:
The sensor package structure serves multiple functions: the insulative layer provides environmental thermal isolation, the thermally conductive layer provides thermal coupling to the target object, and the entire package protects the sensor while maintaining measurement capability. This multi-functionality reduces the need for additional components and simplifies the overall system design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables more accurate temperature sensing by ensuring thermal conductivity to the measurement point while isolating the sensor from environmental influences, thereby improving measurement precision without increasing costs or complexity.
Implementation Method 1
the circuit board provides thermal insulation between the active region of the temperature sensor and an environment on the second side of the circuit board
Implementation Method 2
the first side of the temperature sensor includes an active region configured for coupling with a target area for temperature measurement
Data Source
Figure 1A
Figure 1B
Figure 2
AI summary
A temperature sensor package includes a temperature sensor having a first side and a second side, wherein the first side of the temperature sensor includes an active region configured for coupling with a target area for temperature measurement of an object. The temperature sensor package further includes a circuit board having a first side and a second side, the first side of the circuit board coupled to the second side of the temperature sensor, wherein the circuit board provides thermal insulation between the active region of the temperature sensor and an environment on the second side of the circuit board.