Image Processing Sensor Thermal Partitioning
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Solution Overview
Problem
Image processing sensors in factory production lines face challenges in accurately and easily setting up pass/fail determination criteria for target objects due to the lack of high heat resistance in display units, which are affected by the heat generated from light-emitting elements and camera modules.
Innovation Solution
The design incorporates a casing with a first casing member for housing the illumination and imaging units, a second casing member with a display window for visual checking, and a third casing member with a space partitioning portion to reduce heat conductivity, thereby dissipating heat away from the display unit, ensuring accurate and easy operation while minimizing heat transfer to the display unit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the display unit is integrated into the same casing as the light-emitting elements and camera module, then users can easily and accurately perform setting operations and confirm images, but the display unit is exposed to heat generated by the light-emitting elements and camera module, which may impair its normal operation
Solution Approach 1:
The internal space of the casing is divided into a first space portion housing the light-emitting elements and camera module, and a second space portion housing the display unit. This spatial segmentation isolates the heat-sensitive display unit from the heat-generating components, allowing the display to operate reliably while maintaining integrated functionality for easy user operation.
Solution Approach 2:
A heat insulating wall is introduced as an intermediary structure between the first space portion and the second space portion. This heat insulating wall acts as a thermal barrier that prevents heat transfer from the light-emitting elements and camera module to the display unit, thereby protecting the display unit's operational reliability while allowing both components to coexist in the same casing.
2Temperature
If the casing size is increased to provide heat dissipation space, then heat generated by the light-emitting elements and camera module can be dissipated more effectively, but the image processing sensor becomes larger and loses its compactness
Solution Approach 1:
Instead of increasing the overall sensor volume for heat dissipation, the design utilizes the vertical dimension by extending the casing in the height direction. The heat insulating wall is positioned vertically between the upper light-emitting/camera section and the lower display section, effectively dissipating heat through the vertical dimension while maintaining a compact footprint in the horizontal plane.
Solution Approach 2:
The casing internal space is segmented into distinct functional zones with the heat insulating wall creating thermal separation. This segmentation allows heat to be contained and dissipated in the first space portion without affecting the second space portion, achieving effective heat management within a compact overall sensor volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration prevents the display unit from malfunctioning due to heat, allowing for accurate and easy setting operations and miniaturization of the image processing sensor without the need for increased casing size for heat dissipation.
Implementation Method 1
a heat conductivity of each of the second side surface of the third casing member and the space partitioning portion is lower than a heat conductivity of the first casing member
Data Source
AI summary
An image processing sensor which enables users to perform a setting operation accurately and easily while confirming an image of a target object is provided.The image processing sensor has a configuration in which a power supply board, an illumination substrate, a main substrate, an imaging substrate, and a display substrate are housed in an internal space of a casing. The casing includes a first casing member, a second casing member, and a coupling casing member. The coupling casing member is interposed between the first casing member and the second casing member.