Cylindrical Sensor Tip Recess for Uniform Solder Distribution
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Solution Overview
Problem
The soldering process in measuring devices with cylindrical sensor tips is challenging due to non-controllable fluctuations, making it difficult to achieve consistent thermal and metrological characteristics, particularly in flow meters, where the small diameter of the sensor tip and the need for uniform solder distribution complicate the production and calibration of these devices.
Innovation Solution
A step-like recess is formed inside the sensor tip housing to provide a defined area for solder distribution, using a ceramic substrate with a conductor film or direct wiring for the temperature-sensitive component, allowing for reproducible soldering with a uniform thickness and improved heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional soldering process is used on small diameter sensor tip, then soldering can be performed, but non-controllable fluctuations occur leading to significant variations in sensor characteristics
Solution Approach 1:
The sensor tip housing is segmented into two distinct regions: a recessed area and a protruding area. The recess serves as a dedicated soldering zone with controlled geometry, separating the soldering process from the rest of the sensor tip structure. This segmentation allows for precise control of solder distribution while isolating the temperature-sensitive component in the protruding area from direct solder contact, thereby reducing manufacturing variations.
Solution Approach 2:
The recess is pre-formed in the housing before the soldering process. This preliminary structural preparation defines the exact area where solder will be applied and controls its distribution. By having the recess ready in advance, the soldering process becomes more predictable and controllable, reducing fluctuations in solder thickness and position that would otherwise affect sensor characteristics.
2Temperature
If solder is applied to ensure thermal conduction, then heat transfer improves, but solder displacement and non-uniform distribution occur during the process
Solution Approach 1:
The recess creates a localized zone with specific geometric properties optimized for solder application. The walls of the recess confine the solder to a specific area, ensuring uniform thickness and distribution only where needed. This local quality control allows excellent thermal contact between solder and housing while preventing solder from displacing to unwanted areas, maintaining both heat transfer efficiency and manufacturing precision.
Solution Approach 2:
The recess acts as an intermediary structure between the solder and the temperature-sensitive component. It provides a controlled interface that ensures uniform solder distribution and thermal conduction while physically preventing direct contact between displaced solder and the component. This intermediary geometry mediates between the conflicting requirements of good thermal contact and uniform solder application.
3Manufacturing precision
If displacement mechanism is added to control component approach, then defined positioning is achieved, but manufacturing complexity and overhead increase
Solution Approach 1:
The recess structure enables the solder to self-distribute uniformly within its confined space during the soldering process. The geometry of the recess automatically guides and limits solder flow, eliminating the need for external displacement mechanisms or complex positioning systems. The system uses its own structural features to achieve precise component positioning and uniform solder distribution, reducing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing effort and calibration needs by ensuring consistent solder distribution and enhanced heat transfer, minimizing variations in sensor characteristics and eliminating the need for complex displacement mechanisms during soldering.
Implementation Method 1
a thermally conductive, but electrically insulating layer which is disposed between the temperature sensitive component and the solder, ensures the almost loss-free transmission of the temperature to this component
Implementation Method 2
subsequently to melt the solder
Implementation Method 3
the soldering process, in which the component in question is connected to the inner bottom of a housing consisting e.g. of stainless steel
Data Source
AI summary
A measuring device, in particular for use in the process measurement technology, including a cylindrical sensor tip which includes a closed housing, a sensor element disposed within the housing in the form of a temperature dependent resistor and for generating a sensor signal, and electronic components, which are connected to the sensor element via electrical connecting lines and/or a conductor film, wherein said sensor element is thermally connected to the housing by means of a solder and a heat conducting, electrically insulating layer is disposed between the sensor element and the solder is provided.