Integrated Sensor Device Trench Decoupling Stress Relief
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Solution Overview
Problem
The production of integrated sensor devices, particularly MEMS sensors, is complex and costly due to the need for chip-to-chip bonding and separate wire bonding, which introduces mechanical stresses that negatively affect sensor performance.
Innovation Solution
The implementation of trenches in the sensor chip to mechanically decouple the sensor element from the rest of the chip, combined with the use of conductor tracks instead of bond wires and a dielectric protective layer, allows for stress relief and a more compact design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If chip-to-chip bonding and separate wire bonding are used to integrate sensor elements with electronic circuits, then functional integration is achieved, but production complexity and cost increase
Solution Approach 1:
The patent merges the sensor element and electronic circuit into a single integrated chip structure, eliminating the need for separate chip-to-chip bonding and wire bonding processes. The sensor element is directly formed on the semiconductor chip, and electrical connections are established through conductor tracks integrated into the chip itself, thereby reducing production complexity while maintaining functional integration.
Solution Approach 2:
The semiconductor chip serves multiple functions simultaneously: it acts as both the electronic circuit carrier and the sensor element substrate. The conductor tracks provide both electrical connection and mechanical support, while the mold compound provides both encapsulation and structural support, reducing the need for separate specialized components.
2Reliability
If chip-to-chip bonding and wire bonding are used to integrate sensor elements, then electrical connections are established, but mechanical stresses are introduced that negatively affect sensor performance
Solution Approach 1:
The patent segments the sensor element from the rest of the chip structure by forming trenches around the sensor element. This segmentation creates a mechanically isolated region that protects the sensor element from stresses generated during bonding and chip handling, while still allowing electrical connections through the conductor tracks.
Solution Approach 2:
The trenches act as an intermediary structure between the sensor element and the chip substrate. They provide a stress-isolating boundary that decouples mechanical stresses from the sensor element, while the conductor tracks serve as intermediary electrical pathways that maintain connectivity without transmitting mechanical stresses.
3Object-affected harmful factors
If the sensor chip is completely encapsulated in mold compound, then protection is provided, but the sensor element cannot physically contact the surrounding medium
Solution Approach 1:
The patent applies local quality by leaving the sensor element region unencapsulated while encapsulating the rest of the chip. The mold compound is deliberately excluded from the sensor element area, creating a localized opening that allows physical contact between the sensor element and the surrounding medium, while still providing protection to the electronic circuits.
Solution Approach 2:
The encapsulation is segmented into two distinct regions: the sensor element area remains open for medium contact, while the electronic circuit area is enclosed for protection. This spatial segmentation allows the chip to simultaneously achieve both protection and sensor functionality.
4Reliability
If conventional bonding processes are used to integrate sensor elements, then electrical connections are established, but production cost increases
Solution Approach 1:
The patent combines multiple functions into the chip fabrication process itself: sensor element formation, conductor track creation, and electrical connection are all integrated into the semiconductor manufacturing process, eliminating the need for separate bonding operations and reducing production cost.
Solution Approach 2:
The chip structure itself provides the electrical connections through integrated conductor tracks, eliminating the need for external bonding processes. The chip serves its own connection needs internally, reducing dependency on costly external bonding operations.
Data Source
AI summary
A description is given of a sensor device and a method for producing same. According to one example implementation, the sensor device includes a chip carrier, a semiconductor chip mounted on the chip carrier, and electrical connections between connection pads of the semiconductor chip and corresponding connection pads of the chip carrier. The sensor device further includes a sensor chip arranged on the semiconductor chip and having a sensor element. The sensor chip has trenches that mechanically decouple the sensor element from the rest of the sensor chip. The chip package forms a mold compound that at least partially encapsulates the semiconductor chip and the electrical connections and has an opening in the region of the sensor element so that the sensor element can interact with a medium surrounding the sensor device. The mold compound covers the semiconductor chip except for the sensor chip.