Sensor Unit Asymmetric Mounting for Compact Gyro Packages

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Solution Overview

Problem

Existing gyro packages face challenges in mounting due to the need for new terminal designs and precise perpendicularity control, making them difficult to manufacture and ensuring vertical posture, which limits their availability and functionality.

Innovation Solution

A sensor unit design featuring a board with conductive terminals along its contour, allowing existing gyro packages to be used by connecting electrodes and terminals via a conductive body, ensuring electrical and mechanical fixation while minimizing height and size, and using chip resistors or capacitors to improve electrical characteristics without modifying the packages.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If existing gyro packages are used with standard mounting structures, then manufacturing complexity increases due to the need for new terminal designs and precise perpendicularity control, but device availability decreases

Engineering Contradiction:
Improvemanufacturing complexityVSAvoiddevice availability
Core Design Contradiction:
Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The invention divides the mounting structure into two independent parts: the board with conductive terminals and the sensor device with electrodes. This segmentation allows the sensor device to be mounted without requiring precise perpendicularity control of the entire package, simplifying manufacturing while maintaining compatibility with existing gyro packages

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention transitions from traditional vertical mounting (requiring precise perpendicularity) to a configuration where the sensor device is mounted with its outer surface disposed on the side surface of the board. This dimensional change allows the electrodes to connect to conductive terminals along the contour, eliminating the need for precise perpendicularity control and enabling use of existing gyro packages

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If connectors are used to fit the gyro package to the board, then connection reliability improves, but device complexity increases due to additional connector members

Engineering Contradiction:
Improveconnection reliabilityVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The invention merges the electrical connection function and mechanical fixation function into a single integrated structure. The conductive terminals on the board directly contact the electrodes on the sensor device, eliminating the need for separate connector members. This reduces structural complexity while maintaining reliable electrical and mechanical connection

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The invention extracts the connector members from the mounting structure, removing the intermediate connection components. The electrodes connect directly to the conductive terminals along the contour of the board, simplifying the overall structure while ensuring reliable connection through direct contact

Inventive Principle:
Principle #2Taking out (Extraction)

3Shape

If the sensor device is mounted centered on the board, then structural symmetry is maintained, but height increases due to equal projection lengths on both sides

Engineering Contradiction:
Improvestructural symmetryVSAvoidheight
Core Design Contradiction:
ShapeVSLength of stationary object

Solution Approach 1:

The invention adopts an asymmetric mounting configuration where the sensor device is positioned such that the first projection length (on the first surface side) is smaller than the second projection length (on the second surface side). This asymmetric arrangement reduces the overall height of the sensor unit while maintaining stable electrical and mechanical connection through the conductive terminals along the contour

Inventive Principle:
Principle #4Asymmetry

Data Source

PatentUS9468994B2Sensor unit, method of manufacturing the same, electronic apparatus, and moving object
Publication Date: 2016.10.18 SEIKO EPSON CORP
  • US9468994B2 patent drawing
  • US9468994B2 patent drawing
  • US9468994B2 patent drawing

AI summary

A sensor unit is provided with a sensor device. The sensor device has a first electrode disposed on an outer surface. A board is provided with a first surface and a second surface in an obverse-reverse relationship with each other, and a side surface. A first conductive terminal is disposed along a contour of the first surface. The sensor device has the outer surface disposed along the side surface of the board, and has the first electrode connected to the first conductive terminal with a first conductive body, and a first projection length of the outer surface projecting on the first surface side is smaller than a second projection length of the outer surface projecting on the second surface side.