Sensor Unit With Insulated Metal Body and Direct Circuit Trace
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Solution Overview
Problem
Existing sensor units for position measurement devices are susceptible to external influences and lack economical production methods, often requiring wire bonding and being sensitive to electromagnetic fields.
Innovation Solution
A sensor unit with a metal body and an electrically insulating molding compound surrounding an electronic component, where the electronic component is directly contacted through a circuit trace without wires, and the metal body provides mechanical fastening and shielding, ensuring robustness and precision.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is used to electrically contact the electronic component, then reliable electrical connection is achieved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent extracts and eliminates the wire bonding process from the sensor unit construction. Instead of using separate wires to connect the electronic component to the circuit board, the electrical connection is achieved directly through contact pads on the circuit board that mate with corresponding contacts on the electronic component, thereby removing the harmful complexity of wire bonding while maintaining reliable electrical connection.
Solution Approach 2:
The circuit board serves multiple functions: it provides the electrical connection interface for the electronic component, provides mechanical support and positioning, and serves as the mounting structure for the entire sensor unit. This multi-functionality eliminates the need for separate wire bonding processes and simplifies the overall device construction.
2Reliability
If the sensor unit is made robust against external influences, then measurement reliability improves, but manufacturing cost and complexity increase
Solution Approach 1:
The patent combines multiple protective and structural functions into a single integrated housing structure. The housing simultaneously provides mechanical protection for the electronic component, electromagnetic shielding, and precise positioning features. This merging of functions achieves robust measurement reliability without requiring separate complex manufacturing processes for each protective feature.
Solution Approach 2:
The patent employs specific material properties and geometric parameters in the housing design to achieve robustness. By carefully selecting material thickness, conductivity parameters for electromagnetic shielding, and dimensional tolerances for positioning, the design achieves reliable measurement performance through optimized parameters rather than through complex structural arrangements that would increase manufacturing difficulty.
3Strength
If a metal body is used for mechanical fastening and shielding, then structural strength and EMI shielding improve, but electromagnetic interference with electronic components may occur
Solution Approach 1:
The patent introduces an intermediate non-conductive layer or coating between the metal housing and the electronic component. This intermediary layer electrically isolates the electronic component from the conductive metal housing, preventing electromagnetic interference and ground loops, while the metal housing continues to provide structural strength and external electromagnetic shielding.
Solution Approach 2:
The patent applies different surface treatments or coatings to different regions of the metal housing. The external surfaces maintain high conductivity for electromagnetic shielding, while the internal surfaces contact the electronic component are treated with non-conductive coatings or platings to prevent interference. This local differentiation of electrical properties allows the metal housing to simultaneously provide strength and shielding without causing EMI.
Data Source
AI summary
A sensor unit for measuring the position of a component that is movable relative to the sensor unit includes a metal body, which has a first opening. An electronic component is arranged in the first opening such that a gap is provided between the electronic component and the metal body, the gap being filled with an electrically insulating molding compound. In addition, an electrically insulating first layer is applied on the electronic component and on the molding compound. The electronic component is electrically contacted with a circuit trace, and the circuit trace is routed through the first layer in a first section and extends on the first layer in a second section.