Sensor-Mounted Wafer Structure for Precise Chamber Sensing
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Solution Overview
Problem
Conventional semiconductor manufacturing processes face challenges in precisely monitoring temperature and plasma conditions within chambers, leading to defects and yield issues due to indirect measurement methods and equipment malfunctions.
Innovation Solution
A sensor-mounted wafer design featuring a lower case with a mounting groove, a circuit board with electronic components, and an upper case with an insertion groove, utilizing metal layers and adhesive layers with thermal conductivity to disperse heat and prevent warpage, while forming edge grooves for accurate temperature and plasma sensing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a temperature sensor or plasma sensor is mounted on a test wafer to directly sense temperature or plasma in a chamber, then measurement precision is improved, but the sensor mounted wafer may experience warpage due to temperature rise
Solution Approach 1:
The wafer is divided into a sensor mounting region and a separate sensorless region. The sensorless region acts as a compensation area that does not undergo thermal stress, allowing it to counterbalance the warpage caused by temperature rise in the sensor mounting region. This segmentation enables the wafer to maintain overall flatness while still allowing precise temperature sensing at the sensor mounting location.
2Temperature
If metal layers are added to disperse heat and prevent warpage, then thermal management is improved, but device complexity increases
Solution Approach 1:
Metal layers are selectively deposited only in the sensorless region of the wafer, not across the entire wafer surface. This localized application of metal provides thermal management and warpage prevention specifically where needed (in the sensorless region) without adding unnecessary complexity to the entire device structure.
3Ease of manufacture
If edge mounting grooves are formed close to the edges of the wafer, then ease of manufacture is improved, but the risk of wafer damage during processing increases
Solution Approach 1:
The sensorless region is formed first as a robust base structure before any sensor mounting or additional processing steps are performed. This preliminary formation of the sensorless region creates a stable foundation that protects the wafer edges during subsequent manufacturing processes, reducing damage risk while still allowing easy formation of mounting grooves close to the edges.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables precise temperature sensing, reduces damage rates, improves product quality, and accurately measures plasma density and uniformity, preventing component malfunctions and warpage phenomena.
Implementation Method 1
metal layers and adhesive layers with thermal conductivity to disperse heat
Implementation Method 2
adhesive layers with thermal conductivity to disperse heat
Data Source
AI summary
A sensor mounted wafer includes a lower case, a circuit board, a metal layer, an upper case and lower case. A mounting groove is formed on a surface of the lower case. An electronic component is mounted on the circuit board, and placed in the mounting groove. The upper case having an insertion groove on a surface of the upper case, wherein the electronic component is inserted into the insertion groove, and the upper case is bonded together to the lower case. The metal layer placed on at least one surface of the lower case and the upper case.