Thermoanalytical Sensor Wire Bonding via Inverted Substrate Insertion
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Solution Overview
Problem
Thermoanalytical sensors with top-side wire loops for connecting temperature sensor units to electronic circuits are prone to damage and limit the number of connections, making them less robust and user-friendly, especially when trying to accommodate multiple contacts.
Innovation Solution
A method of manufacturing thermoanalytical sensors where metallic wires are inserted through the substrate and bonded to contact pads on the top side, forming a compact metal ball connection that avoids wire loops, allowing for a higher density of connections and improved robustness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire loops are used to connect temperature sensor units to electronic circuits on the top side of the sensor, then the connection is established, but the sensor becomes less robust and wire loops occupy valuable surface space
Solution Approach 1:
Instead of bringing wires from the top side to connect to contact pads (creating wire loops), the invention inverts the approach by inserting wires from the underside of the substrate through to the top side. This eliminates the wire loops on the surface while maintaining electrical connections, thereby improving robustness and freeing up surface space.
2Adaptability or versatility
If multiple connections are arranged on the sensor surface using wire loops, then electrical connectivity is achieved, but the number of connections is limited due to space constraints
Solution Approach 1:
The invention moves the wire insertion point to the underside of the substrate, effectively utilizing the third dimension (depth/thickness of the substrate) to resolve the surface space constraint. By routing wires through the substrate thickness rather than across the surface, multiple connections can be accommodated without occupying valuable top-side space.
3Ease of operation
If wire loops are formed on the top side of the sensor for electrical connections, then connectivity is established, but the wire loops are prone to damage and reduce user-friendliness
Solution Approach 1:
The invention extracts the wire loops from the top side surface of the sensor by routing wires through the substrate from the underside. This removes the problematic wire loops that are prone to damage and interfere with sample placement, thereby improving both reliability and ease of operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables a significant increase in the number of connections on the sensor surface, enhancing its robustness and usability by eliminating wire loops and reducing space usage, allowing for more efficient arrangement of temperature and heating elements.
Implementation Method 1
The upper end of the wire which protrudes at the top side of the substrate is melted and thereby takes on the form of a small metal ball
Implementation Method 2
the metal ball is fused to the contact pad through the application of pressure and heat, whereby the wire is bonded to the contact pad
Data Source
AI summary
A thermoanalytical sensor has a substrate, a measurement position, a temperature sensor unit, and an electrical contact pad. The temperature sensor unit senses the temperature at the measurement position. It is connected via the electrical contact pad to a metallic wire and thereby tied into an electronic circuit. The substrate is prepared with at least one measurement position, at least one temperature sensor unit and at least one electrical contact pad on a top side of the substrate. A passage in the substrate allows connection to the electrical contact pad. A metallic wire is inserted into the passage from the bottom side of the substrate and melted into a small ball on the upper end of the wire. A materially integral connection as a bonded joint between the upper end of the metallic wire and the electrical contact pad is made by applying pressure and heat to the metal ball.