Sensor Wire Layout Using Intersecting Surfaces to Cut Height
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Solution Overview
Problem
Existing sensor devices face challenges in increasing the degree of freedom in shape or dimensions due to the protrusion of bonding wires, which increases the height and can lead to stress being transferred to the sensor element, affecting its accuracy.
Innovation Solution
A sensor device configuration where the bonding wires connect intersecting surfaces of the sensor element and supporting member, reducing the height by separating the sensor element and supporting member, and using a coupling member to intersect with the substrate, thereby shortening the bonding wire length and reducing stress transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the bonding wire connects the upper surfaces of the substrate and sensor element facing the same direction, then the electrical connection is achieved, but the height dimension of the sensor device increases due to wire protrusion
Solution Approach 1:
The patent changes the spatial arrangement from connecting two parallel surfaces to connecting an upper surface with a side surface. The bonding wire connects the upper surface of the sensor element to the side surface of the substrate, utilizing a different dimensional approach (from Z-axis to X-Y plane intersection) to reduce wire length and eliminate protrusion while maintaining electrical connectivity.
2Reliability
If the bonding wire is long to connect separated components, then the electrical connection is achieved, but stress is transferred to the sensor element affecting accuracy
Solution Approach 1:
By connecting the side surface of the substrate with the upper surface of the sensor element, the bonding wire path is shortened and repositioned. This dimensional change reduces wire length, minimizing stress transfer to the sensor element and preserving measurement accuracy while maintaining reliable electrical connection.
3Strength
If the sensor element and supporting member are bonded together, then structural support is provided, but the degree of freedom in shape or dimensions is reduced
Solution Approach 1:
The patent separates the sensor element from the supporting member, eliminating direct bonding between them. This segmentation allows independent positioning and orientation of each component, increasing the degree of freedom in shape and dimension configuration while the supporting member still provides structural support through its separate placement on the substrate.
Data Source
AI summary
A sensor device includes a sensor element, a supporting member, a substrate, and a bonding wire. The supporting member is electrically connected to the sensor element. The substrate is electrically connected to the supporting member. The bonding wire forms at least part of a connection path that electrically connects the sensor element and the supporting member together. The substrate and an installation member on which the sensor element is installed intersect with each other. The sensor element and the supporting member are separated from each other.