Sensor Wiring Resin Structure for Improved Waterproof Sealing

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing sensor devices with wiring members embedded in resin molded parts face challenges in achieving adequate waterproofness between the wiring member and the resin molded part.

Innovation Solution

A sensor device design that includes a sensor element, a wiring member, a first resin molded part covering the sensor element and wiring member, and a second resin molded part molded separately and combined with the first part to form an integral piece, thereby improving waterproofness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If the wiring member is embedded in a resin molded part, then the sensor device structure is simplified, but the waterproofness between the wiring member and resin molded part deteriorates

Engineering Contradiction:
ImprovestructureVSAvoidwaterproofness
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The resin molded part is divided into two separately molded parts that are subsequently combined. The first resin molded part embeds the wiring member, while the second resin molded part is molded separately and combined with the first part. This segmentation allows each part to be optimized independently, improving waterproofness at the interface between the wiring member and resin while maintaining structural simplicity.

Inventive Principle:
Principle #1Segmentation

2Ease of manufacture

If the resin molded part is molded as a single piece, then the manufacturing process is simplified, but thermal effects cause wiring member contraction and sink marks that reduce waterproofness

Engineering Contradiction:
Improvemolding processVSAvoidwaterproofness
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The molding process is segmented into two separate molding operations. The first resin molded part is molded with the wiring member embedded, and the second resin molded part is molded separately. This segmentation reduces the thermal load on the wiring member during molding, suppressing contraction and sink marks, thereby improving waterproofness while keeping each molding step relatively simple.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The first resin molded part is molded first with the wiring member already in position, establishing a preliminary structure. Then the second resin molded part is molded separately and combined with the first part. This preliminary action allows the wiring member to be properly positioned and partially protected before the complete resin structure is formed, reducing thermal damage.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design enhances waterproofness by reducing thermal effects on the wiring member, suppressing contraction, and minimizing sink marks, while maintaining a desired shape for the sensor device.

Implementation Method 1

the waterproofness between an end portion of a wiring member and a resin molded part is further improved

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS12276672B2Sensor device
Publication Date: 2025.04.15 SUMITOMO WIRING SYSTEMS LTD
  • US12276672B2 patent drawing
  • US12276672B2 patent drawing
  • US12276672B2 patent drawing

AI summary

An object is to further improve the waterproofness between an end portion of a wiring member and a resin molded part. Disclosed is a sensor device including: a sensor element; a wiring member connected to the sensor element; a first resin molded part that covers the sensor element and an end portion of the wiring member; and a second resin molded part molded separately from the first resin molded part and combined with the first resin molded part into an integral piece.