Sensorized Pick Arm for Fragile Microelectronic Device Handling
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Solution Overview
Problem
The increasing fragility of microelectronic devices due to reduced thickness and the susceptibility to cracking during handling operations, such as pick and place, is exacerbated by the lack of cushioning in thin dielectric films and contamination in bond lines, leading to stress-induced damage and yield reduction.
Innovation Solution
The implementation of a pick and place apparatus equipped with force sensors and acoustic sensors to detect and prevent excessive force and misalignment during handling, and the use of sensor arrays to monitor contact forces and locations, allowing for real-time adjustment and diversion of potentially damaged devices for inspection or discard.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the thickness of microelectronic devices is reduced to about 50 μm or less, then the footprint and height of the assembly are reduced, but the device fragility and susceptibility to cracking under stress increases
Solution Approach 1:
A cushioning member is introduced between the pick arm and the microelectronic device during handling operations. This cushioning member absorbs impact forces and distributes stress, preventing cracking in the thin device while maintaining the reduced thickness design. The cushioning member is positioned in advance during the pick operation to protect the device from stress-induced damage.
2Volume of moving object
If the bond line thickness is decreased, then the height of the 3D assembly is reduced, but the ability to accommodate particulate contaminants and provide cushioning effect is lost
Solution Approach 1:
A cushioning member is introduced as an intermediary element during the pick and place operation. This member acts as a mediator between the handling apparatus and the thin microelectronic device, providing mechanical protection and stress distribution. The cushioning member compensates for the reduced bond line thickness by providing the necessary cushioning effect during handling, while the actual bond line remains thin for height reduction.
3Reliability
If force sensors and acoustic sensors are added to detect and prevent excessive force during handling, then the potential for damage is reduced, but the device complexity increases
Solution Approach 1:
Force sensors and acoustic sensors are integrated into the pick arm to provide real-time feedback during handling operations. The force sensors monitor the contact force between the pick arm and the device, while acoustic sensors detect cracking sounds. This feedback system allows the control system to adjust handling parameters dynamically, preventing excessive force application and detecting potential damage early, thereby improving reliability despite the increased complexity.
Data Source
AI summary
An apparatus for handling microelectronic devices comprises a pick arm having a pick surface configured for receiving a microelectronic device thereon, drives for moving the pick arm and reorienting the pick surface in the X, Y and Z planes and about a horizontal rotational axis and a vertical rotational axis, and a sensor device carried by the pick arm and configured to detect at least one of at least one magnitude of force and at least one location of force applied between the pick surface and a structure contacted by the pick surface or a structure and a microelectronic device carried on the pick surface.