Sensorized Wafer Storage Rails for In-Transit Wafer Measurement

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Solution Overview

Problem

Conventional microelectronic device manufacturing processes require additional acts to measure physical changes in wafers, which is time-consuming and increases the risk of wafer contamination or damage.

Innovation Solution

A wafer storage device equipped with sensors integrated into the rails, allowing for the measurement of physical properties such as weight, thickness, and nonplanarity of wafers during transportation and storage, eliminating the need for separate measurement apparatus and acts.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If separate measurement apparatus and acts are used to measure physical properties of wafers, then measurement precision can be ensured, but manufacturing time increases and risk of wafer contamination or damage increases

Engineering Contradiction:

Improvemeasurement precisionVSAvoidmanufacturing time

Core Design Contradiction:

Measurement precisionVSProductivity

Solution Approach 1:

The patent combines the measurement function with the storage device by integrating sensors directly into the storage device structure. This allows the same device to both store wafers and measure their physical properties, eliminating the need for separate measurement apparatus and reducing manufacturing time while maintaining measurement precision.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The storage device is designed to perform multiple functions: storing wafers and measuring their physical properties simultaneously. The sensors integrated into the storage device enable it to monitor wafer characteristics without requiring dedicated measurement equipment, thereby improving productivity while ensuring measurement accuracy.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Measurement precision

If separate measurement apparatus and acts are used to measure physical properties of wafers, then measurement precision can be ensured, but device complexity increases

Engineering Contradiction:

Improvemeasurement precisionVSAvoiddevice complexity

Core Design Contradiction:

Measurement precisionVSDevice complexity

Solution Approach 1:

The patent merges the measurement capability into the storage device by integrating sensors directly into its structure. This reduces the overall system complexity by eliminating separate measurement apparatus while maintaining measurement precision through the combined functionality.

Inventive Principle:

Principle #5Merging (Combining)

3Measurement precision

If additional measurement acts are performed during manufacturing, then measurement precision can be ensured, but time consumption increases

Engineering Contradiction:

Improvemeasurement precisionVSAvoidtime consumption

Core Design Contradiction:

Measurement precisionVSLoss of time

Solution Approach 1:

The integrated sensors enable continuous monitoring of wafer physical properties during storage and transport without interrupting the manufacturing process. This eliminates the need for separate measurement acts, reducing time consumption while ensuring measurement precision through ongoing surveillance.

Inventive Principle:

Principle #20Continuity of useful action

Solution Approach 2:

The measurement capability is built into the storage device, allowing physical properties to be measured in advance and continuously during storage and transport. This preliminary and ongoing measurement approach eliminates the need for additional measurement acts later in the process, reducing time consumption while maintaining precision.

Inventive Principle:

Principle #10Preliminary action

4Measurement precision

If wafers are handled separately for measurement, then measurement precision can be ensured, but risk of wafer contamination or damage increases

Engineering Contradiction:

Improvemeasurement precisionVSAvoidrisk of wafer contamination or damage

Core Design Contradiction:

Measurement precisionVSObject-affected harmful factors

Solution Approach 1:

The patent combines storage and measurement functions in a single device, allowing wafers to be measured in situ without being removed from the storage device. This eliminates additional handling steps that could cause contamination or damage, while measurement precision is maintained through the integrated sensors.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The storage device performs measurement functions itself through integrated sensors, eliminating the need for external measurement apparatus and the associated handling operations. This self-service capability reduces the risk of wafer contamination or damage by minimizing handling while maintaining measurement precision.

Inventive Principle:

Principle #25Self-service

Data Source

PatentUS20250149362A1Wafer processing systems, wafer transport devices, and related methods

Publication Date: 2025.05.08 MICRON TECHNOLOGY INC

AI summary

A wafer storage device may include one or more mutually aligned rails extending from two opposing side walls, each pair of mutually aligned rails configured to support a wafer between the side walls. The wafer storage device includes one or more sensors coupled to at least some of the one or more rails. The one or more sensors may be configured to detect a physical property of the wafer. The wafer storage device may further include a processor configured to analyze data from the one or more sensors, and a memory device. The memory device may be configured to store data produced by at least the one or more sensors or the processor. The wafer storage device may also include a power storage device configured to receive power from an external source and supply power to the one or more sensors and the processor.