Separable Antenna PCB Coupling Structure for 5G Mass Production
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Solution Overview
Problem
Existing antenna structures in wireless communication systems, particularly in 5G technology, face challenges in achieving high performance and efficient design due to space constraints and difficulties in mass production, especially with conventional solder ball attachment methods leading to warpage and breakage issues.
Innovation Solution
A separable antenna structure is implemented using a flexible printed circuit board (FPCB) with an adhesive material for coupling to a printed circuit board (PCB), allowing for stable connection and efficient mass production, with design factors such as plating thickness, number of platings, and via hole disposition to enhance robustness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a wireless communication device includes multiple antennas for MIMO or beamforming, then communication reliability and data rate are improved, but device size and complexity increase
Solution Approach 1:
The antenna system is divided into a main body antenna and a separable antenna module. The separable antenna can be detached and replaced, allowing the device to maintain multiple antennas for MIMO/beamforming while reducing overall complexity through modular design. This segmentation enables independent optimization of each antenna component.
2Reliability
If a wireless communication device includes multiple antennas for MIMO or beamforming, then communication reliability and data rate are improved, but device size increases
Solution Approach 1:
The separable antenna is designed to be attachable to and detachable from the main body, allowing it to be nested or integrated with the device housing when not in use. This nesting approach enables multiple antennas to be accommodated without proportionally increasing device volume, as antennas can be stored compactly when not actively used.
3Stability of the object's composition
If antennas are fixed in the device, then structural stability is maintained, but adaptability to different communication environments is reduced
Solution Approach 1:
The antenna system transitions from a static fixed configuration to a dynamic reconfigurable system. The separable antenna can be attached or detached based on communication requirements, environmental conditions, or user preferences. This dynamic capability allows the device to adapt to different communication environments while maintaining structural stability when the antenna is properly connected.
4Adaptability or versatility
If antennas are made separable and detachable, then adaptability and user customization are improved, but connection reliability and signal transmission may deteriorate
Solution Approach 1:
A connection structure with coupling members is introduced as an intermediary between the main body antenna and the separable antenna. This coupling mechanism provides reliable electrical and mechanical connection while allowing easy attachment and detachment. The intermediary connection structure ensures signal transmission integrity despite the separable nature of the antenna, resolving the conflict between user customization and connection reliability.
Data Source
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AI summary
The present disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting a higher data transmission rate than a 4th generation (4G) communication system such as long term evolution (LTE). According to embodiments of the present disclosure, the antenna module comprises: a plurality of antennas; a first printed circuit board (PCB) on which the plurality of antennas are disposed; a second PCB on which one or more elements for processing a radio frequency (RF) signal are disposed; and an adhesive material for bonding the first PCB and the second PCB, wherein the first PCB includes a first metal layer, a second metal layer, a dielectric, and a coupling structure plated along the first metal layer, the second metal layer, and a via hole between the first metal layer and the second metal layer, and may be disposed to provide a coupling connection through the coupling structure of the first PCB and a coupling pad of the second PCB.