Separate Die Programmable Fabric and Support Circuitry
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Programmable logic devices face challenges in achieving rapid configuration and efficient power management due to the integration of programmable logic fabric and support circuitry within a single die, which limits their speed and increases manufacturing costs.
Innovation Solution
The use of a programmable logic device composed of two separate dies, where one die contains primarily programmable logic fabric and the other die contains fabric support circuitry, including device controllers, memory, and power management components, allowing for efficient operation and rapid reconfiguration of the programmable logic fabric.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If programmable logic fabric and support circuitry are integrated within a single die, then device complexity is reduced and manufacturing is simplified, but configuration speed is limited and power consumption increases
Solution Approach 1:
The patent divides the programmable logic device into two separate dies: a first die containing the programmable logic fabric and a second die containing the support circuitry. This segmentation allows the fabric to be configured independently at higher speeds while the support circuitry remains stable, resolving the contradiction between configuration speed and device complexity.
2Use of energy by moving object
If programmable logic fabric and support circuitry are integrated within a single die, then manufacturing processes are simplified, but power consumption increases and manufacturing costs increase
Solution Approach 1:
By separating the fabric die from the support circuitry die, the patent enables independent optimization of power consumption for each component. The fabric can be powered only during configuration operations, while support circuitry maintains stable power supply, reducing overall power consumption despite increased manufacturing complexity.
Solution Approach 2:
The support circuitry is extracted from the fabric die and placed on a separate die. This extraction allows the fabric to operate with minimal power consumption during configuration, as only the necessary fabric elements are powered during partial reconfiguration operations.
3Quantity of substance
If programmable logic fabric and support circuitry are integrated within a single die, then device density is reduced, but manufacturing precision requirements are lowered
Solution Approach 1:
The patent segments the device into two specialized dies, allowing each to be optimized for its specific function. The fabric die can achieve higher density with smaller, more tightly spaced logic elements, while the support circuitry die handles control functions, collectively enabling higher overall density despite requiring precise inter-die alignment.
Data Source
AI summary
An integrated circuit device having separate dies for programmable logic fabric and circuitry to operate the programmable logic fabric are provided. A first integrated circuit die may include field programmable gate array fabric. A second integrated circuit die may be coupled to the first integrated circuit die. The second integrated circuit die may include fabric support circuitry that operates the field programmable gate array fabric of the first integrated circuit die.