Separate-Gate CFET Nanosheet Structure for Electrical Isolation
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Solution Overview
Problem
As semiconductor devices scale to smaller dimensions, particularly at the 5 nanometer production node and beyond, there is a need for increased effective channel width per footprint area in FinFET devices, which nanosheet technologies aim to address, but challenges arise in isolating and integrating complementary FET (CFET) devices effectively.
Innovation Solution
A semiconductor structure is designed with a first nanosheet device and a second nanosheet device separated by an isolation layer, along with distinct gate contacts for each, allowing for electrically isolated nFET and pFET structures within a CFET device, utilizing deposition, etching, and lithography processes to form separate gate-all-around configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If nanosheet devices are scaled to smaller dimensions to increase effective channel width per footprint area, then device integration density is improved, but electrical isolation between complementary FET structures becomes more difficult to achieve
Solution Approach 1:
The patent divides the CFET structure into separate nFET and pFET regions with distinct gate contacts, allowing independent control and isolation of each transistor type while maintaining high integration density through vertical stacking
Solution Approach 2:
An isolation layer is introduced between the nFET and pFET structures to provide electrical isolation, preventing unwanted interaction between the complementary transistors while allowing both to occupy the same footprint area
2Power
If a common gate structure is formed wrapping around nanosheet layers to increase effective channel width, then drive current is improved, but electrical isolation between nFET and pFET channels deteriorates
Solution Approach 1:
The gate structure is segmented into separate gate contacts for nFET and pFET, with the nFET gate contact isolated from the pFET gate contact by an isolation layer, allowing each transistor to have its own controlled gate while maintaining high drive current through vertical stacking
Solution Approach 2:
An isolation layer is positioned between the gate contacts of nFET and pFET to prevent electrical interaction, ensuring that the high drive current capability of the stacked structure does not compromise the electrical isolation between complementary channels
Data Source
AI summary
A semiconductor structure comprises a first nanosheet device having at least one first channel layer and a first gate, a second nanosheet device disposed above the first nanosheet device and having at least one second channel layer and a second gate, and an isolation layer disposed between the first nanosheet device and the second nanosheet device to electrically isolate the first nanosheet device and the second nanosheet device.


