Optical Emission Assembly With Separate Thermal Paths for Beam Combining
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Solution Overview
Problem
Existing optical modules face issues with heat energy dissipation from multiple light-emitting chips disposed on the same plane, leading to shortened service life or the need for additional cooling chips.
Innovation Solution
The optical emission assembly disperses light-emitting chips on different heat-conducting bases, providing two separate heat dissipation paths to prevent heat accumulation, using a multiplexer to combine light beams and a converging lens to direct the combined beam into an optical fiber ferrule.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple light-emitting chips are disposed on the same plane, then the optical emission assembly can accommodate more optical signals in a single fiber optic cable, but the heat energy generated by the multiple light-emitting chips cannot be effectively dissipated through the supporting base
Solution Approach 1:
The patent transitions from a planar arrangement of light-emitting chips to a three-dimensional stacked configuration. Multiple light-emitting chips are arranged on different planes (first plane and second plane) within the optical emission assembly, allowing heat to dissipate through multiple thermal paths via separate supporting bases while maintaining high transmission capacity through wavelength division multiplexing.
2Productivity
If multiple light-emitting chips are disposed on the same plane, then the optical emission assembly can accommodate more optical signals in a single fiber optic cable, but additional cooling chips need to be disposed between the multiple light-emitting chips and the supporting base
Solution Approach 1:
By arranging light-emitting chips on different planes vertically, the patent eliminates the need for additional cooling chips between chips and supporting base. Each plane has its own supporting base that directly conducts heat away from the light-emitting chips, simplifying the thermal management structure while maintaining high transmission capacity.
3Productivity
If multiple light-emitting chips are disposed on the same plane, then the optical emission assembly can accommodate more optical signals in a single fiber optic cable, but the service life of the light-emitting chip is shortened
Solution Approach 1:
The patent extends the service life of light-emitting chips by distributing them across multiple planes with separate supporting bases for heat dissipation. This three-dimensional arrangement ensures effective heat removal from each chip, preventing thermal accumulation that would otherwise shorten chip lifespan, while maintaining high transmission capacity through wavelength division multiplexing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively dissipates heat from multiple light-emitting chips without additional cooling chips, prolonging the service life and improving heat management in optical modules.
Implementation Method 1
the N first light-emitting chips are configured to emit light beams toward the accommodation groove; the M second light-emitting chips are configured to emit light beams toward the accommodation groove
Implementation Method 2
The multiplexer is disposed at the bottom of the accommodation groove, and is configured to combine the light beams emitted by the N first light-emitting chips and the M second light-emitting chips into one light beam
Implementation Method 3
The converging lens is disposed in the through hole, and is configured to converge the one light beam emitted from the multiplexer to the optical fiber ferrule
Implementation Method 4
the heat energy generated by the multiple light-emitting chips may not be effectively dissipated through the supporting base
Data Source
AI summary
Disclosed is an optical emission assembly including a body, an adapter, two light-emitting assemblies, a multiplexer and a converging lens. The body is provided with a first positioning groove, a second positioning groove, an accommodation groove, and a through hole. The accommodation groove communicates with the first and second positioning grooves and the through hole. A groove bottom of the first positioning groove communicates with a groove bottom of the second positioning groove. The adapter is connected to the body and disposed corresponding to the through hole. When the two light-emitting assemblies are installed in the first and second positioning grooves, each light-emitting chip of each light-emitting assembly emits beams towards the accommodation groove to make the multiplexer disposed at the bottom of the accommodation groove combine the beams into one beam. The converging lens is disposed in the through hole to converge the one beam on the adapter.