Physically Separated Etching Modules for Component Carrier Precision
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Solution Overview
Problem
Conventional etching systems for component carrier manufacturing fail to achieve accurate and cost-efficient etching, resulting in insufficient etching factors, which limit the reliability and performance of component carriers, especially in terms of signal transmission and mechanical robustness.
Innovation Solution
The implementation of an etching system comprising physically and chemically separated etching modules, each with its own control unit and supply/drain system, allowing for independent operation and communicative coupling to achieve specific etching factors of 15 or more through tailored etching schemes and additive use.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional etching module with physically connected sub-modules and common etching bath is used, then the device complexity is reduced and ease of manufacture is improved, but the manufacturing precision of etching factor deteriorates (achieves only around 3)
Solution Approach 1:
The etching module is divided into multiple physically separated sub-modules (first etching sub-module, second etching sub-module, etc.), each with its own independent etching bath, inlet, and outlet. This segmentation allows each sub-module to apply different etching schemes with customized chemical compositions, temperatures, and parameters, thereby achieving high manufacturing precision (etching factor of 15 or more) while maintaining reasonable device complexity through modular design
2Manufacturing precision
If a common etching bath with uniform chemical composition is used across all sub-modules, then the ease of operation is improved and device complexity is reduced, but the manufacturing precision of etching factor deteriorates
Solution Approach 1:
Each etching sub-module is equipped with its own inlet and outlet for the etching bath, allowing local customization of chemical composition, temperature, and other parameters. The first sub-module may use one chemical formulation while the second uses another, enabling precise control over the etching process at each stage to achieve the target etching factor of 15 or more, while the centralized control unit maintains ease of operation through automated coordination
3Manufacturing precision
If physically separated etching modules with independent supply and drain systems are implemented, then the manufacturing precision of etching factor is improved (achieves 15 or more), but the device complexity increases
Solution Approach 1:
The etching modules are designed with universal interfaces and standardized components for the supply and drain systems. Each sub-module has its own inlet and outlet, but they all connect to a centralized control unit that coordinates their operation. This universal design allows the system to achieve high manufacturing precision (etching factor of 15 or more) through independent parameter control while keeping device complexity manageable through standardized multi-functional components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of component carriers with etching factors of 25 or more, enhancing the accuracy and reliability of metal traces while maintaining cost-efficiency, thereby improving the mechanical and electrical performance of component carriers.
Implementation Method 1
The etching process is shown as an application of etching solution (from the common etching bath) from above and from below the conveyor belt
Implementation Method 2
After etching a copper layer, an etched (trapezoidal) copper structure can be described
Data Source
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Figure 4a~7
Figure 8~10
AI summary
There is described an etching system (100) for component carrier manufacturing, comprising: i) a first etching module (110) having: ia) a first control unit (115) for applying a first etching scheme; ib) a first inlet (116) for a first supply; and ic)a first outlet (118) for a first drain; and ii) a second etching module (120), having: iia) a second control unit (125) for applying a second etching scheme; iib) a second inlet (126) for a second supply; and iic) a second outlet (128) for a second drain. The first etching module (110) and the second etching module (120) are physically separated, one etching module (110, 120) is arranged process-downstream to the other etching module (110, 120), and the first etching module (110) and the second etching module (120) are communicatively coupled. Further, a component carrier manufacture system, a method of etching, a component carrier, and a process control device are described.